Issued Patents All Time
Showing 1–25 of 549 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424587 | Semiconductor device having underfill surrounding bottom package and solder ball | Ying-Ching Shih, Pu Wang, Chen-Hua Yu | 2025-09-23 |
| 12387996 | Through-substrate vias with improved connections | Ku-Feng Yang | 2025-08-12 |
| 12382630 | Semiconductor assemblies including combination memory and methods of manufacturing the same | — | 2025-08-05 |
| 12371790 | Wafer carrier with adjustable alignment devices and deposition equipment using the same | Yu-Te Shen | 2025-07-29 |
| 12368090 | Method of manufacturing semiconductor device including passivation layer | Li-Hui Cheng, Po-Hao Tsai | 2025-07-22 |
| 12362260 | Methods of packaging semiconductor devices and packaged semiconductor devices | Li-Hui Cheng, Po-Hao Tsai | 2025-07-15 |
| 12266612 | Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features | Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jiun-Ren Lai, Yung-Chi Lin | 2025-04-01 |
| 12249581 | Method of manufacture overlay mark using laser marking process for semiconductor device | Chen-Hua Yu, Po-Hao Tsai | 2025-03-11 |
| 12237238 | Package structure and method | Szu-Wei Lu, Chen-Hua Yu | 2025-02-25 |
| 12237291 | Dummy structure of stacked and bonded semiconductor device | Li-Hui Cheng, Po-Hao Tsai | 2025-02-25 |
| 12198904 | Thin-film-deposition equipment | Yu-Te Shen | 2025-01-14 |
| 12191287 | Package structure | Po-Hao Tsai | 2025-01-07 |
| 12170242 | Fan-out wafer level package structure | — | 2024-12-17 |
| 12148661 | Method of forming integrated fan-out packages with built-in heat sink | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu, Long Hua Lee | 2024-11-19 |
| 12131898 | Bonded semiconductor structures | — | 2024-10-29 |
| 12129541 | Deposition method for tuning magnetic field distribution of deposition equipment | — | 2024-10-29 |
| 12123092 | Powder-atomic-layer-deposition device with knocker | Chia-Cheng Ku | 2024-10-22 |
| 12125721 | Parallelism-adjustable bonding machine | Jung-Hua Chang, Mao-Chan Chang | 2024-10-22 |
| 12080617 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Long Hua Lee +1 more | 2024-09-03 |
| 12068224 | Semiconductor packages having thermal conductive pattern | Szu-Wei Lu | 2024-08-20 |
| 12057432 | Integrated fan-out package structures with recesses in molding compound | Po-Hao Tsai, Li-Hui Cheng, Jui-Pin Hung | 2024-08-06 |
| 12040215 | Bonding machine with movable suction modules | Jung-Hua Chang | 2024-07-16 |
| 12031208 | Atomic layer deposition apparatus for powders | Jung-Hua Chang, Chia-Cheng Ku | 2024-07-09 |
| 12006571 | Atomic layer deposition apparatus for coating on fine powders | CHING-LIANG YI, Jung-Hua Chang, Chia-Cheng Ku | 2024-06-11 |
| 11987883 | Powder atomic layer deposition apparatus for blowing powders | Jung-Hua Chang, Chia-Cheng Ku | 2024-05-21 |