Issued Patents All Time
Showing 1–25 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374651 | Wafer bonding method | Tsang-Jiuh Wu, Wen-Chih Chiou, Chen-Hua Yu | 2025-07-29 |
| 12374655 | Method of forming package structure by using a wafer chuck with adjustable curved surface | Wen-Chih Chiou, Yen-Ming Chen | 2025-07-29 |
| 12322680 | Semiconductor device having backside interconnect structure on through substrate via | Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih, Chia-Yin Chen +3 more | 2025-06-03 |
| 12266612 | Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features | Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jing-Cheng Lin, Jiun-Ren Lai | 2025-04-01 |
| 12261151 | Integrated circuit packages | Chia-Hao Hsu, Wen-Chih Chiou | 2025-03-25 |
| 12179044 | Positive-pressure protective wear | Chao-Ting Lin, Tzu-Ying Lin | 2024-12-31 |
| 12087732 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2024-09-10 |
| 12015008 | Wafer bonding method | Tsang-Jiuh Wu, Wen-Chih Chiou, Chen-Hua Yu | 2024-06-18 |
| 11948920 | Semiconductor device and method for manufacturing the same, and semiconductor package | I-Chun Hsu, Yan-Zuo Tsai, Chia-Yin Chen, Yang-Chih Hsueh, Tsang-Jiuh Wu +1 more | 2024-04-02 |
| 11855021 | Semiconductor structure with through substrate vias and manufacturing method thereof | Chen-Hua Yu, Tsang-Jiuh Wu, Wen-Chih Chiou | 2023-12-26 |
| 11854990 | Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die | Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jing-Cheng Lin, Jiun-Ren Lai | 2023-12-26 |
| 11855067 | Integrated circuit package and method | Chen-Hua Yu, Wen-Chih Chiou | 2023-12-26 |
| 11823979 | Method of forming semiconductor device having backside interconnect structure on through substrate via | Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih, Chia-Yin Chen +3 more | 2023-11-21 |
| 11756883 | Through via structure and method | Hsin-Yu Chen, Lin-Chih Huang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2023-09-12 |
| 11728314 | Methods of forming integrated circuit packages | Chia-Hao Hsu, Wen-Chih Chiou | 2023-08-15 |
| 11728296 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Ku-Feng Yang +2 more | 2023-08-15 |
| 11721666 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2023-08-08 |
| 11502072 | Integrated circuit package and method | Chen-Hua Yu, Wen-Chih Chiou | 2022-11-15 |
| 11437344 | Wafer bonding method | Tsang-Jiuh Wu, Wen-Chih Chiou, Chen-Hua Yu | 2022-09-06 |
| 11304290 | Semiconductor structures and methods | Chen-Hua Yu, Wen-Chih Chiou | 2022-04-12 |
| 11145623 | Integrated circuit packages and methods of forming the same | Chia-Hao Hsu, Wen-Chih Chiou | 2021-10-12 |
| 11101240 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2021-08-24 |
| 11063008 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Tsang-Jiuh Wu, Wen-Chih Chiou | 2021-07-13 |
| 11056419 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih, Chia-Yin Chen +3 more | 2021-07-06 |
| 10923431 | Method for forming a 3D IC architecture including forming a first die on a first side of a first interconnect structure and a second die in an opening formed in a second side | Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jing-Cheng Lin, Jiun-Ren Lai | 2021-02-16 |