Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728296 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2023-08-15 |
| 10811374 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2020-10-20 |
| 10157866 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2018-12-18 |
| 9953920 | Interconnect structure and method | Hsin-Yu Chen, Ku-Feng Yang, Lin-Chih Huang, Yuan-Hung Liu, Tsang-Jiuh Wu +1 more | 2018-04-24 |
| 9748190 | Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation | Hsin-Yu Chen, Lin-Chih Huang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2017-08-29 |
| 9679859 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2017-06-13 |
| 9252110 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2016-02-02 |
| 9006101 | Interconnect structure and method | Hsin-Yu Chen, Ku-Feng Yang, Lin-Chih Huang, Yuan-Hung Liu, Tsang-Jiuh Wu +1 more | 2015-04-14 |
| 8951838 | Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation | Hsin-Yu Chen, Lin-Chih Huang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2015-02-10 |