Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756883 | Through via structure and method | Yung-Chi Lin, Hsin-Yu Chen, Tsang-Jiuh Wu, Wen-Chih Chiou | 2023-09-12 |
| 11728296 | Interconnect structure and method of forming same | Hsiao Yun Lo, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2023-08-15 |
| 10811374 | Interconnect structure and method of forming same | Hsiao Yun Lo, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2020-10-20 |
| 10714423 | Through via structure and method | Yung-Chi Lin, Hsin-Yu Chen, Tsang-Jiuh Wu, Wen-Chih Chiou | 2020-07-14 |
| 10290604 | Substrateless integrated circuit packages and methods of forming same | Hung-An Teng, Hsin-Yu Chen, Tsang-Jiuh Wu, Cheng-Chieh Hsieh | 2019-05-14 |
| 10217687 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Hsien-Wei Chen, An-Jhih Su, Li-Hsien Huang | 2019-02-26 |
| 10157866 | Interconnect structure and method of forming same | Hsiao Yun Lo, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2018-12-18 |
| 9953920 | Interconnect structure and method | Hsin-Yu Chen, Ku-Feng Yang, Tasi-Jung Wu, Yuan-Hung Liu, Tsang-Jiuh Wu +1 more | 2018-04-24 |
| 9929069 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Hsien-Wei Chen, An-Jhih Su, Li-Hsien Huang | 2018-03-27 |
| 9842825 | Substrateless integrated circuit packages and methods of forming same | Hung-An Teng, Hsin-Yu Chen, Tsang-Jiuh Wu, Cheng-Chieh Hsieh | 2017-12-12 |
| 9831177 | Through via structure | Yung-Chi Lin, Hsin-Yu Chen, Tsang-Jiuh Wu, Wen-Chih Chiou | 2017-11-28 |
| 9748190 | Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation | Hsin-Yu Chen, Tsang-Jiuh Wu, Tasi-Jung Wu, Wen-Chih Chiou | 2017-08-29 |
| 9679859 | Interconnect structure and method of forming same | Hsiao Yun Lo, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2017-06-13 |
| 9564345 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Hsien-Wei Chen, An-Jhih Su, Li-Hsien Huang | 2017-02-07 |
| 9252110 | Interconnect structure and method of forming same | Hsiao Yun Lo, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2016-02-02 |
| 9112007 | Through via structure and method | Yung-Chi Lin, Hsin-Yu Chen, Tsang-Jiuh Wu, Wen-Chih Chiou | 2015-08-18 |
| 9006101 | Interconnect structure and method | Hsin-Yu Chen, Ku-Feng Yang, Tasi-Jung Wu, Yuan-Hung Liu, Tsang-Jiuh Wu +1 more | 2015-04-14 |
| 8951838 | Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation | Hsin-Yu Chen, Tasi-Jung Wu, Tsang-Jiuh Wu, Wen-Chih Chiou | 2015-02-10 |
| 8395200 | Method and system for manufacturing copper-based capacitor | Zhen Chen, Yung-Feng Lin | 2013-03-12 |
| 8324692 | Integrated inductor | Zhen Chen, Yung-Feng Lin | 2012-12-04 |
| 6527431 | Combined mixing and injecting device for a mold | Kelven Chen | 2003-03-04 |