Issued Patents All Time
Showing 1–25 of 182 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431417 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, Der-Chyang Yeh, Hua-Wei Tseng, Chiang-Hung Lin, Ming-Shih Yeh | 2025-09-30 |
| 12368280 | Semiconductor device and method | Chen-Hua Yu, Chia-Nan Yuan, Shih-Guo Shen, Der-Chyang Yeh, Yu-Hung Lin +1 more | 2025-07-22 |
| 12347749 | Semiconductor packages | Wei-Yu Chen, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2025-07-01 |
| 12341104 | Methods of manufacturing semiconductor devices | Yu-Hung Lin, Der-Chyang Yeh, Shih-Guo Shen, Chia-Nan Yuan, Ming-Shih Yeh | 2025-06-24 |
| 12327819 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2025-06-10 |
| 12283492 | Photonic integrated package and method forming same | Chen-Hua Yu, Wei-Yu Chen | 2025-04-22 |
| 12266633 | Semiconductor structure and method of forming the same | Chih-Chien Pan, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2025-04-01 |
| 12218104 | Method for forming chip package structure with molding layer | Wei-Yu Chen | 2025-02-04 |
| 12159853 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Yueh-Ting Lin, Shao-Yun Chen, Li-Hsien Huang, Ming-Shih Yeh +1 more | 2024-12-03 |
| 12142524 | Via for component electrode connection | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2024-11-12 |
| 12119320 | Chip package structure with bump | Wei-Yu Chen, Li-Hsien Huang, Hsien-Wei Chen | 2024-10-15 |
| 12087745 | Package structure and manufacturing method thereof | Wei-Yu Chen, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai +2 more | 2024-09-10 |
| 12062602 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, Der-Chyang Yeh, Hua-Wei Tseng, Chiang-Hung Lin, Ming-Shih Yeh | 2024-08-13 |
| 12033949 | Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, Ying-Ching Shih, Szu-Wei Lu +2 more | 2024-07-09 |
| 12021051 | Semiconductor package and method of forming the same | Hsien-Wei Chen | 2024-06-25 |
| 12020953 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2024-06-25 |
| 12009335 | Structure and method of forming a joint assembly | Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2024-06-11 |
| 11961800 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2024-04-16 |
| 11935836 | Semiconductor devices | Yu-Hung Lin, Der-Chyang Yeh, Shih-Guo Shen, Chia-Nan Yuan, Ming-Shih Yeh | 2024-03-19 |
| 11929322 | Method of forming device and package structure | Hsien-Wei Chen, Li-Hsien Huang | 2024-03-12 |
| 11908795 | Package structures and method of forming the same | Chen-Hua Yu | 2024-02-20 |
| 11901196 | Method for forming photonic integrated package | Chen-Hua Yu, Wei-Yu Chen | 2024-02-13 |
| 11854994 | Redistribution structure for integrated circuit package and method of forming same | Chen-Hua Yu, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2023-12-26 |
| 11855047 | Chip package structure with conductive shielding film | Chen-Hua Yu, Jing-Cheng Lin, Po-Hao Tsai | 2023-12-26 |
| 11842983 | Semiconductor structure | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Tien-Chung Yang | 2023-12-12 |