Issued Patents All Time
Showing 1–25 of 227 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412851 | Semiconductor device and method of manufacture | Po-Yao Chuang, Ming-Chih Yew, Shin-Puu Jeng | 2025-09-09 |
| 12412857 | Hybrid micro-bump integration with redistribution layer | Ting-Li Yang, Yi-Wen Wu, Sheng-Pin Yang, Hao-Chun Liu | 2025-09-09 |
| 12368090 | Method of manufacturing semiconductor device including passivation layer | Jing-Cheng Lin, Li-Hui Cheng | 2025-07-22 |
| 12368120 | Semiconductor device and method | Chen-Shien Chen, Ting-Li Yang, Chien-Chen Li, Ming-Da Cheng | 2025-07-22 |
| 12362260 | Methods of packaging semiconductor devices and packaged semiconductor devices | Li-Hui Cheng, Jing-Cheng Lin | 2025-07-15 |
| 12308322 | Dual-sided routing in 3D semiconductor system-in-package structure and methods of forming the same | Po-Yao Chuang, Meng-Liang Lin, Yi-Wen Wu, Shin-Puu Jeng, Techi Wong | 2025-05-20 |
| 12308313 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Techi Wong, Po-Yao Chuang, Shih-Ting Hung, Shin-Puu Jeng | 2025-05-20 |
| 12300592 | Fan-out package with controllable standoff | Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2025-05-13 |
| 12255166 | Semiconductor package structure comprising via structure and redistribution layer structure | Neng-Chieh CHANG, Ming-Da Cheng, Wen-Hsiung Lu, Hsu-Lun Liu | 2025-03-18 |
| 12249581 | Method of manufacture overlay mark using laser marking process for semiconductor device | Jing-Cheng Lin, Chen-Hua Yu | 2025-03-11 |
| 12243837 | Semiconductor device and method | Ting-Li Yang, Ming-Da Cheng, Yung-Han Chuang, Hsueh-Sheng Wang | 2025-03-04 |
| 12237291 | Dummy structure of stacked and bonded semiconductor device | Li-Hui Cheng, Jing-Cheng Lin | 2025-02-25 |
| 12237262 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Techi Wong, Po-Yao Chuang, Shih-Ting Hung, Shin-Puu Jeng | 2025-02-25 |
| 12199084 | Fan-out package with cavity substrate | Techi Wong, Po-Yao Chuang, Shin-Puu Jeng, Meng-Wei Chou, Meng-Liang Lin | 2025-01-14 |
| 12191287 | Package structure | Jing-Cheng Lin | 2025-01-07 |
| 12176337 | Semiconductor devices and methods of manufacturing | Yi-Wen Wu, Po-Yao Chuang, Meng-Liang Lin, Techi Wong, Shih-Ting Hung +1 more | 2024-12-24 |
| 12131984 | Heterogeneous fan-out structure and method of manufacture | Po-Yao Chuang, Shin-Puu Jeng, Techi Wong | 2024-10-29 |
| 12132021 | Method for fabricating semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-10-29 |
| 12100666 | Method for forming chip package structure | Shin-Puu Jeng, Techi Wong, Po-Yao Lin, Ming-Chih Yew, Po-Yao Chuang | 2024-09-24 |
| 12094819 | Method for forming package structure | Techi Wong, Meng-Liang Lin, Yi-Wen Wu, Po-Yao Chuang, Shin-Puu Jeng | 2024-09-17 |
| 12087648 | Seal ring structure with zigzag patterns and method forming same | Kuan-Hung Chen, Hong-Seng Shue, Mirng-Ji Lii | 2024-09-10 |
| 12087745 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang +2 more | 2024-09-10 |
| 12074104 | Integrated circuit packages with ring-shaped substrates | Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2024-08-27 |
| 12057432 | Integrated fan-out package structures with recesses in molding compound | Li-Hui Cheng, Jui-Pin Hung, Jing-Cheng Lin | 2024-08-06 |
| 12057423 | Bump integration with redistribution layer | Ting-Li Yang, Ching-Wen Hsiao, Hong-Seng Shue, Ming-Da Cheng | 2024-08-06 |