Issued Patents All Time
Showing 51–75 of 227 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817413 | Semiconductor package structure comprising via structure and redistribution layer structure and method for forming the same | Neng-Chieh CHANG, Ming-Da Cheng, Wen-Hsiung Lu, Hsu-Lun Liu | 2023-11-14 |
| 11784148 | Semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-10-10 |
| 11776935 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Chen-Hua Yu | 2023-10-03 |
| 11764159 | Package with fan-out structures | Shin-Puu Jeng, Po-Yao Chuang, Techi Wong | 2023-09-19 |
| 11764139 | Semiconductor device and method | Jing-Cheng Lin, Chi-Hsi Wu, Chen-Hua Yu | 2023-09-19 |
| 11756802 | Thermally conductive material in the recess of an encapsulant and sidewall of an integrated circuit device | Jing-Cheng Lin, Li-Hui Cheng | 2023-09-12 |
| 11682599 | Chip package structure with molding layer and method for forming the same | Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2023-06-20 |
| 11670577 | Chip package with redistribution structure having multiple chips | Shin-Puu Jeng, Po-Yao Chuang, Feng-Cheng Hsu, Shuo-Mao Chen, Techi Wong | 2023-06-06 |
| 11646256 | Heterogeneous fan-out structure and method of manufacture | Po-Yao Chuang, Shin-Puu Jeng, Techi Wong | 2023-05-09 |
| 11610854 | Semiconductor device and method of manufacture | Po-Yao Chuang, Ming-Chih Yew, Shin-Puu Jeng | 2023-03-21 |
| 11605579 | Semiconductor device having passivation layer and method of manufacturing the same | Jing-Cheng Lin, Li-Hui Cheng | 2023-03-14 |
| 11600575 | Method for forming chip package structure | Shin-Puu Jeng, Techi Wong, Po-Yao Lin, Ming-Chih Yew, Po-Yao Chuang | 2023-03-07 |
| 11600573 | Structure and formation method of chip package with conductive support elements to reduce warpage | Techi Wong, Yi-Wen Wu, Po-Yao Chuang, Shin-Puu Jeng | 2023-03-07 |
| 11594508 | Redistribution lines having nano columns and method forming same | Ming-Da Cheng, Wen-Hsiung Lu, Hsu-Lun Liu, Kai-Di Wu, Su-Fei Lin | 2023-02-28 |
| 11532867 | Heterogeneous antenna in fan-out package | Po-Yao Chuang, Shin-Puu Jeng | 2022-12-20 |
| 11527418 | Integrated circuit packages and methods of forming same | Jing-Cheng Lin, Li-Hui Cheng | 2022-12-13 |
| 11527474 | Integrated circuit package and method | Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2022-12-13 |
| 11488843 | Underfill between a first package and a second package | Jing-Cheng Lin, Li-Hui Cheng | 2022-11-01 |
| 11462509 | Package structure with electronic device in cavity substrate and method for forming the same | Ming-Da Cheng, Mirng-Ji Lii | 2022-10-04 |
| 11450567 | Package component with stepped passivation layer | Ming-Da Cheng, Tzy-Kuang Lee, Song-Bor Lee, Wen-Hsiung Lu, Wen-Che Chang | 2022-09-20 |
| 11430776 | Semiconductor devices and methods of manufacturing | Yi-Wen Wu, Po-Yao Chuang, Meng-Liang Lin, Techi Wong, Shih-Ting Hung +1 more | 2022-08-30 |
| 11430739 | Structure and formation method of package structure with fan-out structure | Hsien-Wen Liu, Shin-Puu Jeng, Meng-Liang Lin, Shih-Yung PENG, Shih-Ting Hung | 2022-08-30 |
| 11393783 | Dummy structure of stacked and bonded semiconductor device | Li-Hui Cheng, Jing-Cheng Lin | 2022-07-19 |
| 11393770 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Chen-Hua Yu | 2022-07-19 |
| 11387217 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Chen-Hua Yu | 2022-07-12 |