Issued Patents All Time
Showing 101–125 of 227 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062997 | Method for forming chip package structure | Shin-Puu Jeng, Techi Wong, Po-Yao Lin, Ming-Chih Yew, Po-Yao Chuang | 2021-07-13 |
| 11062987 | Semiconductor device | Jing-Cheng Lin, Chi-Hsi Wu, Chen-Hua Yu | 2021-07-13 |
| 11056471 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Li-Hui Cheng, Porter Chen | 2021-07-06 |
| 11037861 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Yi-Jou Lin, Shuo-Mao Chen, Chiung-Han Yeh +1 more | 2021-06-15 |
| 11018081 | Heterogeneous fan-out structure and method of manufacture | Po-Yao Chuang, Shin-Puu Jeng, Techi Wong | 2021-05-25 |
| 10985100 | Chip package with recessed interposer substrate | Shin-Puu Jeng, Po-Yao Chuang, Feng-Cheng Hsu, Shuo-Mao Chen, Techi Wong | 2021-04-20 |
| 10971461 | Semiconductor device and method of manufacture | Po-Yao Chuang, Ming-Chih Yew, Shin-Puu Jeng | 2021-04-06 |
| 10937742 | Package and manufacturing method thereof | — | 2021-03-02 |
| 10879194 | Semiconductor device package and method of manufacturing the same | Jing-Cheng Lin, Li-Hui Cheng, Jeh-Yin Chang, Li-Chung Kuo, Hsien-Ju Tsou +3 more | 2020-12-29 |
| 10872850 | Package structure and method of forming thereof | Li-Hui Cheng, Jing-Cheng Lin | 2020-12-22 |
| 10854563 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2020-12-01 |
| 10840218 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Chen-Hua Yu | 2020-11-17 |
| 10818607 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Chen-Hua Yu | 2020-10-27 |
| 10818583 | Semiconductor devices, methods of manufacture thereof, and semiconductor device packages | I-Ting Chen, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2020-10-27 |
| 10804247 | Chip package structure with conductive shielding film | Chen-Hua Yu, An-Jhih Su, Jing-Cheng Lin | 2020-10-13 |
| 10804254 | Fan-out package with cavity substrate | Techi Wong, Po-Yao Chuang, Shin-Puu Jeng, Meng-Wei Chou, Meng-Liang Lin | 2020-10-13 |
| 10790162 | Integrated circuit package and method | Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2020-09-29 |
| 10784123 | Integrated circuit packages and methods of forming same | Jing-Cheng Lin, Li-Hui Cheng | 2020-09-22 |
| 10763132 | Release film as isolation film in package | Jing-Cheng Lin, Li-Hui Cheng | 2020-09-01 |
| 10741520 | Method of controlling bump height variation | Jing-Cheng Lin | 2020-08-11 |
| 10720403 | Integrated fan-out package structures with recesses in molding compound | Li-Hui Cheng, Jui-Pin Hung, Jing-Cheng Lin | 2020-07-21 |
| 10672752 | Semiconductor package and manufacturing method thereof | Li-Hui Cheng, Jing-Cheng Lin | 2020-06-02 |
| 10665559 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2020-05-26 |
| 10658347 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Jing-Cheng Lin | 2020-05-19 |
| 10636775 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang +2 more | 2020-04-28 |