Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12294002 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2025-05-06 |
| 12087733 | Packages with multiple types of underfill and method forming the same | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou | 2024-09-10 |
| 12080617 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2024-09-03 |
| 12051668 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Tsung-Yu Chen, Chien-Yuan Huang | 2024-07-30 |
| 12021008 | Thermal interface materials, 3D semiconductor packages and methods of manufacture | Chen-Hua Yu, Ying-Ching Shih, Szu-Wei Lu | 2024-06-25 |
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2024-06-18 |
| 11990429 | Dummy die placement without backside chipping | Chih-Wei Wu, Ying-Ching Shih, Kung-Chen Yeh, Pu Wang, Szu-Wei Lu | 2024-05-21 |
| 11842936 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2023-12-12 |
| 11699674 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Tsung-Yu Chen, Chien-Yuan Huang | 2023-07-11 |
| 11637086 | Sawing underfill in packaging processes | Szu-Wei Lu, Ying-Da Wang, Jing-Cheng Lin | 2023-04-25 |
| 11631654 | Sawing underfill in packaging processes | Szu-Wei Lu, Ying-Da Wang, Jing-Cheng Lin | 2023-04-18 |
| 11621205 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2023-04-04 |
| 11515267 | Dummy die placement without backside chipping | Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Kung-Chen Yeh | 2022-11-29 |
| 11482465 | Thermal interface materials, 3D semiconductor packages and methods of manufacture | Chen-Hua Yu, Szu-Wei Lu, Ying-Ching Shih | 2022-10-25 |
| 11201097 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Chih-Wei Wu, Long Hua Lee, Sung-Hui Huang, Ying-Ching Shih +1 more | 2021-12-14 |
| 11164824 | Package structure and method of fabricating the same | Tsung-Fu Tsai, Kung-Chen Yeh, Szu-Wei Lu, Ying-Ching Shih | 2021-11-02 |
| 11121050 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Chih-Wei Wu, Long Hua Lee, Sung-Hui Huang, Ying-Ching Shih +1 more | 2021-09-14 |
| 11101236 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Tsung-Yu Chen, Chien-Yuan Huang | 2021-08-24 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2021-08-24 |
| 11075133 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2021-07-27 |
| 11024616 | Package structure and method of manufacturing the same | Yu-Wei Chen, Long Hua Lee, Szu-Wei Lu, Ying-Ching Shih, Kuan-Yu Huang | 2021-06-01 |
| 10879194 | Semiconductor device package and method of manufacturing the same | Jing-Cheng Lin, Li-Hui Cheng, Po-Hao Tsai, Jeh-Yin Chang, Hsien-Ju Tsou +3 more | 2020-12-29 |
| 10861799 | Dummy die placement without backside chipping | Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Kung-Chen Yeh | 2020-12-08 |
| 10840215 | Sawing underfill in packaging processes | Szu-Wei Lu, Ying-Da Wang, Jing-Cheng Lin | 2020-11-17 |
| 10157879 | Die-to-die gap control for semiconductor structure and method | Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih, Ying-Da Wang, Long Hua Lee +2 more | 2018-12-18 |