Issued Patents All Time
Showing 1–25 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412841 | Semiconductor package and manufacturing method thereof | Chen-Hsuan Tsai, Chin-Chuan Chang, Szu-Wei Lu | 2025-09-09 |
| 12387997 | Semiconductor packages | Yi-Jung Chen, Wei-An Tsao, Szu-Wei Lu | 2025-08-12 |
| 12381177 | Package structure and method of fabricating the same | Kung-Chen Yeh, Szu-Wei Lu, Ying-Ching Shih | 2025-08-05 |
| 12368128 | Device bonding apparatus and method of manufacturing a package using the apparatus | Yi-Jung Chen, Szu-Wei Lu | 2025-07-22 |
| 12362245 | Package assembly including a package lid having an inner foot and methods of making the same | Pu Wang, Ying-Ching Shih, Szu-Wei Lu | 2025-07-15 |
| 12353011 | Photonic package and method of manufacture | Hsing-Kuo Hsia, Szu-Wei Lu, Chen-Hua Yu | 2025-07-08 |
| 12347708 | Inspection apparatus, manufacturing method of integrated circuit, and inspection method | Szu-Wei Lu | 2025-07-01 |
| 12315806 | Electronic device and manufacturing method thereof | Hou-Ju Huang, Shih-Ting Lin, Szu-Wei Lu, Hung-Wei Tsai | 2025-05-27 |
| 12272568 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih, Ting-Yu Yeh +1 more | 2025-04-08 |
| 12142499 | Pickup apparatus and method of using the same | Yi-Jung Chen, Szu-Wei Lu | 2024-11-12 |
| 12142579 | Package structure and manufacturing method thereof | Shih-Ting Lin, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang | 2024-11-12 |
| 12119324 | Package structure | Kung-Chen Yeh, Szu-Wei Lu, Ying-Ching Shih | 2024-10-15 |
| 12046561 | Package structure and method of fabricating the same | Szu-Wei Lu | 2024-07-23 |
| 12020952 | Method of fabricating semiconductor device having dummy micro bumps between stacking dies | Chen-Hsuan Tsai, Chung Chieh TING, Shih-Ting Lin, Szu-Wei Lu | 2024-06-25 |
| 11990351 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih, Ting-Yu Yeh +1 more | 2024-05-21 |
| 11948896 | Package structure | Kung-Chen Yeh, I-Ting Huang, Shih-Ting Lin, Szu-Wei Lu | 2024-04-02 |
| 11923259 | Package structure and method of manufacturing the same | Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2024-03-05 |
| 11854984 | Semiconductor package and manufacturing method thereof | Chen-Hsuan Tsai, Chin-Chuan Chang, Szu-Wei Lu | 2023-12-26 |
| 11855060 | Package structure and method of fabricating the same | Chin-Fu Kao, Pu Wang, Szu-Wei Lu | 2023-12-26 |
| 11817425 | Package structure with underfill | Chen-Hsuan Tsai, Shih-Ting Lin, Szu-Wei Lu | 2023-11-14 |
| 11769739 | Package structure and manufacturing method thereof | Shih-Ting Lin, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang | 2023-09-26 |
| 11670593 | Package-on-package (POP) electronic device and manufacturing method thereof | Hou-Ju Huang, Shih-Ting Lin, Szu-Wei Lu, Hung-Wei Tsai | 2023-06-06 |
| 11521905 | Package structure and method of manufacturing the same | Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2022-12-06 |
| 11508692 | Package structure and method of fabricating the same | Kung-Chen Yeh, Szu-Wei Lu, Ying-Ching Shih | 2022-11-22 |
| 11476205 | Package structure and method for forming the same | Kung-Chen Yeh, I-Ting Huang, Shih-Ting Lin, Szu-Wei Lu | 2022-10-18 |