Issued Patents All Time
Showing 26–50 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450615 | Package structure and method of fabricating the same | Szu-Wei Lu | 2022-09-20 |
| 11450654 | Package structure and method of fabricating the same | Chin-Fu Kao, Pu Wang, Szu-Wei Lu | 2022-09-20 |
| 11355454 | Package structure and manufacturing method thereof | Shih-Ting Lin, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang | 2022-06-07 |
| 11205629 | Package structure and method of fabricating the same | Shih-Ting Lin, Szu-Wei Lu | 2021-12-21 |
| 11164824 | Package structure and method of fabricating the same | Kung-Chen Yeh, Li-Chung Kuo, Szu-Wei Lu, Ying-Ching Shih | 2021-11-02 |
| 11133289 | Semiconductor package and manufacturing method of semiconductor package having plurality of encapsulating materials | Shih-Ting Lin, Szu-Wei Lu, Ying-Ching Shih | 2021-09-28 |
| 11101145 | Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material | Chen-Hsuan Tsai, Chung Chieh TING, Shih-Ting Lin, Szu-Wei Lu | 2021-08-24 |
| 10985140 | Structure and formation method of package structure with underfill | Chen-Hsuan Tsai, Shih-Ting Lin, Szu-Wei Lu | 2021-04-20 |
| 10923438 | Package structure and method for forming the same | Kung-Chen Yeh, I-Ting Huang, Shih-Ting Lin, Szu-Wei Lu | 2021-02-16 |
| 10867919 | Electronic device and manufacturing method thereof | Hou-Ju Huang, Shih-Ting Lin, Szu-Wei Lu, Hung-Wei Tsai | 2020-12-15 |
| 10770366 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Wen-Hsiung Lu, Yian-Liang Kuo | 2020-09-08 |
| 10510635 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Wen-Hsiung Lu, Yian-Liang Kuo | 2019-12-17 |
| 10453818 | Packaging structures of integrated circuits | Chia-Wei Tu, Yian-Liang Kuo, Ru-Ying Huang | 2019-10-22 |
| 10269762 | Rework process and tool design for semiconductor package | Shih-Ting Lin, Justin Huang, Jing-Cheng Lin, Chen-Hua Yu | 2019-04-23 |
| 10269750 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2019-04-23 |
| 10157888 | Integrated fan-out packages and methods of forming the same | Jing-Cheng Lin, Chen-Hua Yu, Po-Hao Tsai, Shih-Ting Lin, Szu-Wei Lu +2 more | 2018-12-18 |
| 10056312 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Wen-Hsiung Lu, Yian-Liang Kuo | 2018-08-21 |
| 9929070 | Isolation rings for packages and the method of forming the same | Chih-Horng Chang, Tin-Hao Kuo, Min-Feng Ku | 2018-03-27 |
| 9825601 | Differential two-stage amplifier and operation method thereof | Herming Chiueh | 2017-11-21 |
| 9780009 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Wen-Hsiung Lu, Yian-Liang Kuo | 2017-10-03 |
| 9659890 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2017-05-23 |
| 9620414 | Protecting flip-chip package using pre-applied fillet | Yian-Liang Kuo, Ming-Song Sheu, Yu-Ling Tsai, Chen-Shien Chen, Han-Ping Pu | 2017-04-11 |
| 9548245 | Isolation rings for packages and the method of forming the same | Chih-Horng Chang, Tin-Hao Kuo, Min-Feng Ku | 2017-01-17 |
| 9196532 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Yian-Liang Kuo, Wen-Hsiung Lu, Hsien-Wei Chen | 2015-11-24 |
| 9136235 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2015-09-15 |