Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374599 | Package structure comprising a semiconductor die with thermoelectric elements and manufacturing method thereof | Cheng-Yen Hsieh, Chung-Yu Lu | 2025-07-29 |
| 12100682 | Package structure with conductive patterns in a redistribution layer | Yu-Chia Lai, Hao-Yi Tsai, Chih-Hsuan Tai | 2024-09-24 |
| 12087718 | Bump structure having a side recess and semiconductor structure including the same | Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin | 2024-09-10 |
| 12014979 | Methods of forming semiconductor packages | Kuo Lung Pan, Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Tin-Hao Kuo +1 more | 2024-06-18 |
| 11915994 | Package structure comprising a semiconductor die with a thermoelectric structure and manufacturing method thereof | Cheng-Yen Hsieh, Chung-Yu Lu | 2024-02-27 |
| 11776880 | Surface treatment method and apparatus for semiconductor packaging | Jie Deng, Tin-Hao Kuo, Ying-Yu Chen | 2023-10-03 |
| 11631648 | Bump structure having a side recess and semiconductor structure including the same | Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin | 2023-04-18 |
| 11508656 | Semiconductor package and method | Kuo Lung Pan, Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Tin-Hao Kuo +1 more | 2022-11-22 |
| 11049805 | Semiconductor package and method | Kuo Lung Pan, Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Tin-Hao Kuo +1 more | 2021-06-29 |
| 10867892 | Semiconductor structure and manufacturing method thereof | Cheng-Yen Hsieh | 2020-12-15 |
| 10833033 | Bump structure having a side recess and semiconductor structure including the same | Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin | 2020-11-10 |
| 10811338 | Surface treatment method and apparatus for semiconductor packaging | Jie Deng, Tin-Hao Kuo, Ying-Yu Chen | 2020-10-20 |
| 10522444 | Surface treatment method and apparatus for semiconductor packaging | Jie Deng, Tin-Hao Kuo, Ying-Yu Chen | 2019-12-31 |
| 10388622 | Bump structure having a side recess and semiconductor structure including the same | Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin | 2019-08-20 |
| 10163801 | Structure and formation method of chip package with fan-out structure | Tin-Hao Kuo | 2018-12-25 |
| 9929070 | Isolation rings for packages and the method of forming the same | Tin-Hao Kuo, Tsung-Fu Tsai, Min-Feng Ku | 2018-03-27 |
| 9824992 | Bump structure having a side recess and semiconductor structure including the same | Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin | 2017-11-21 |
| 9548245 | Isolation rings for packages and the method of forming the same | Tin-Hao Kuo, Tsung-Fu Tsai, Min-Feng Ku | 2017-01-17 |
| 9520379 | Method of forming bump structure having a side recess and semiconductor structure including the same | Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin | 2016-12-13 |
| 9425180 | Treating copper surfaces for packaging | Tin-Hao Kuo | 2016-08-23 |
| 9318458 | Bump structure having a side recess and semiconductor structure including the same | Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin | 2016-04-19 |
| 9257385 | Landing areas of bonding structures | Tin-Hao Kuo, Chen-Shien Chen | 2016-02-09 |
| 9105533 | Bump structure having a single side recess | Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin | 2015-08-11 |
| 9059158 | Semiconductor device having under-bump metallization (UBM) structure and method of forming the same | Tsung-Fu Tsai, Yian-Liang Kuo | 2015-06-16 |
| 9048333 | Isolation rings for packages and the method of forming the same | Tin-Hao Kuo, Tsung-Fu Tsai, Min-Feng Ku | 2015-06-02 |