Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374599 | Package structure comprising a semiconductor die with thermoelectric elements and manufacturing method thereof | Cheng-Yen Hsieh, Chih-Horng Chang | 2025-07-29 |
| 12113027 | Three-dimensional integrated circuit structures and methods of forming the same | Ping-Kang Huang, Sao-Ling Chiu | 2024-10-08 |
| 11915994 | Package structure comprising a semiconductor die with a thermoelectric structure and manufacturing method thereof | Cheng-Yen Hsieh, Chih-Horng Chang | 2024-02-27 |
| 11901306 | Semiconductor structure | Yao-Jen Chang, Sao-Ling Chiu | 2024-02-13 |
| 11810793 | Semiconductor packages and methods of forming same | Ping-Kang Huang, Sao-Ling Chiu, Shang-Yun Hou | 2023-11-07 |
| 11728278 | Board substrates, three-dimensional integrated circuit structures and methods of forming the same | Ping-Kang Huang, Sao-Ling Chiu | 2023-08-15 |
| 11502043 | Semiconductor structure and method for fabricating semiconductor structure | Yao-Jen Chang, Sao-Ling Chiu | 2022-11-15 |
| 11495472 | Semicondutor packages and methods of forming same | Ping-Kang Huang, Sao-Ling Chiu, Shang-Yun Hou | 2022-11-08 |
| 10978404 | Semiconductor structure and method for fabricating semiconductor structure | Yao-Jen Chang, Sao-Ling Chiu | 2021-04-13 |
| 10262939 | Configurable routing for packaging applications | Hsien-Pin Hu, Shin-Puu Jeng, Shang-Yun Hou, Tzuan-Horng Liu, Shih-Wen Huang +1 more | 2019-04-16 |
| 9978637 | Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs) | Tzuan-Horng Liu, Shih-Wen Huang, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2018-05-22 |
| 9882240 | Graft copolymer, process for producing the graft copolymer, process for preparing a gel polymer electrolyte including the graft copolymer, and intermediate copolymer of the graft copolymer | Ping-Lin Kuo, Sheng-Shu Hou, Ching-An Wu, CHIH-HAO TSAO, Chun-Han Hsu | 2018-01-30 |
| 9653531 | Methods of manufacturing a package | Hsiao-Tsung Yen, Min-Chie Jeng, Hsien-Pin Hu, Tzuan-Horng Liu, Chin-Wei Kuo +1 more | 2017-05-16 |
| 9627223 | Methods and apparatus of packaging with interposers | Hsien-Pin Hu, Hsiao-Tsung Yen, Tzuan-Horng Liu, Shih-Wen Huang, Shang-Yun Hou +1 more | 2017-04-18 |
| 9530730 | Configurable routing for packaging applications | Hsien-Pin Hu, Shin-Puu Jeng, Shang-Yun Hou, Tzuan-Horng Liu, Shih-Wen Huang +1 more | 2016-12-27 |
| 9305808 | Methods and apparatus of packaging with interposers | Hsien-Pin Hu, Hsiao-Tsung Yen, Tzuan-Horng Liu, Shih-Wen Huang, Shang-Yun Hou +1 more | 2016-04-05 |
| 9064705 | Methods and apparatus of packaging with interposers | Hsien-Pin Hu, Hsiao-Tsung Yen, Tzuan-Horng Liu, Shih-Wen Huang, Shang-Yun Hou +1 more | 2015-06-23 |
| 8896094 | Methods and apparatus for inductors and transformers in packages | Hsiao-Tsung Yen, Yu-Ling Lin, Chin-Wei Kuo, Tzuan-Horng Liu, Hsien-Pin Hu +1 more | 2014-11-25 |