HY

Hsiao-Tsung Yen

RS Realtek Semiconductor: 105 patents #3 of 1,741Top 1%
TSMC: 98 patents #269 of 12,232Top 3%
Overall (All Time): #3,235 of 4,157,543Top 1%
203
Patents All Time

Issued Patents All Time

Showing 1–25 of 203 patents

Patent #TitleCo-InventorsDate
12431283 Inductor device 2025-09-30
12431272 Inductor device 2025-09-30
12400784 Inductor device 2025-08-26
12347606 Inductor device Ting-Yao Huang 2025-07-01
12340928 Transformer device Po-Chih Wang 2025-06-24
12334243 Inductor device Ting-Yao Huang, Ka-Un Chan 2025-06-17
12283935 Radio frequency apparatus and inductance device thereof Hung-Han Chen, Jian-You Chen, Po-Chih Wang 2025-04-22
12266463 Transformer device Ting-Yao Huang 2025-04-01
12224101 Inductor device Ka-Un Chan 2025-02-11
12205751 Inductor device 2025-01-21
12205748 Inductor device Hung-Han Chen, Ka-Un Chan 2025-01-21
12205755 Inductor structure Ka-Un Chan 2025-01-21
12198846 Eight-shaped inductor for use in integrated circuit structure having plurality of wires and each wire has at least two sub-wires Ka-Un Chan 2025-01-14
12176136 Transformer device Jian-You Chen, Ka-Un Chan 2024-12-24
12154708 Inductor device Ka-Un Chan 2024-11-26
12148694 Semiconductor device with patterned ground shielding Chin-Wei Kuo, Cheng-Wei Luo, Kung-Hao Liang 2024-11-19
12112878 Asymmetric spiral inductor Ka-Un Chan 2024-10-08
12112875 Integrated circuit Ka-Un Chan 2024-10-08
12094637 Inductor device Ting-Yao Huang, Ka-Un Chan 2024-09-17
12062480 Inductor device Jian-You Chen, Ka-Un Chan 2024-08-13
12046403 Stacked inductor device Ka-Un Chan 2024-07-23
12040126 Manufacturing method of an inductive device 2024-07-16
12027298 Inductor device Ka-Un Chan 2024-07-02
11978712 Method of forming semiconductor package transmission lines with micro-bump lines Chin-Wei Kuo, Min-Chie Jeng, Yu-Ling Lin 2024-05-07
11942258 Inductor device Ting-Yao Huang, Ka-Un Chan 2024-03-26