Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394602 | Wafer processing method | Chien-Kuo Huang, Joung-Wei Liou, Chia-I Shen, Fei-Fan Chen | 2025-08-19 |
| 12087834 | Semiconductor structure | Chung-Ting Ko, Hong-Hsien Ke, Chia-Hui Lin, Tai-Chun Huang | 2024-09-10 |
| 11990375 | Semiconductor Fin cutting process and structures formed thereby | Jaming Chang, Kai Hung Cheng, Chia-Hui Lin, Jei-Ming Chen | 2024-05-21 |
| 11380593 | Semiconductor fin cutting process and structures formed thereby | Jaming Chang, Kai Hung Cheng, Chia-Hui Lin, Jei-Ming Chen | 2022-07-05 |
| 11296198 | Semiconductor structure with barrier layer and method for forming the same | Chung-Ting Ko, Hong-Hsien Ke, Chia-Hui Lin, Tai-Chun Huang | 2022-04-05 |
| 11183399 | Semiconductor device and method of manufacture | Wen-Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Chi-Hsi Wu, Chen-Hua Yu +6 more | 2021-11-23 |
| 11101140 | Semiconductor device and method of manufacture | Wen-Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Chi-Hsi Wu, Chen-Hua Yu +6 more | 2021-08-24 |
| 11049945 | Semiconductor device structure and method for forming the same | Yun-Wen Chu, Hong-Hsien Ke, Chia-Hui Lin, Shin-Yeu Tsai, Shih-Chieh Chang | 2021-06-29 |
| 10777466 | Semiconductor Fin cutting process and structures formed thereby | Chia-Hui Lin, Jaming Chang, Jei-Ming Chen, Kai Hung Cheng | 2020-09-15 |
| 10741366 | Process chamber and wafer processing method | Chien-Kuo Huang, Joung-Wei Liou, Chia-I Shen, Fei-Fan Chen | 2020-08-11 |
| 10720430 | Forming doped regions in semiconductor strips | Chia-Hui Lin, Shin-Yeu Tsai, Kai Hung Cheng | 2020-07-21 |
| 10629693 | Semiconductor structure with barrier layer and method for forming the same | Chung-Ting Ko, Hong-Hsien Ke, Chia-Hui Lin, Tai-Chun Huang | 2020-04-21 |
| 10522541 | Forming doped regions in semiconductor strips | Chia-Hui Lin, Shin-Yeu Tsai, Kai Hung Cheng | 2019-12-31 |
| 10276677 | Semiconductor device structure and method for forming the same | Yun-Wen Chu, Hong-Hsien Ke, Chia-Hui Lin, Shin-Yeu Tsai, Shih-Chieh Chang | 2019-04-30 |
| 10269796 | Forming doped regions in semiconductor strips | Chia-Hui Lin, Shin-Yeu Tsai, Kai Hung Cheng | 2019-04-23 |
| 10262939 | Configurable routing for packaging applications | Chung-Yu Lu, Hsien-Pin Hu, Shin-Puu Jeng, Shang-Yun Hou, Tzuan-Horng Liu +1 more | 2019-04-16 |
| 10008367 | Gas diffuser unit, process chamber and wafer processing method | Chien-Kuo Huang, Joung-Wei Liou, Chia-I Shen, Fei-Fan Chen | 2018-06-26 |
| 9978637 | Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs) | Tzuan-Horng Liu, Chung-Yu Lu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2018-05-22 |
| 9881918 | Forming doped regions in semiconductor strips | Chia-Hui Lin, Shin-Yeu Tsai, Kai Hung Cheng | 2018-01-30 |
| 9711478 | Semiconductor device with an anti-pad peeling structure and associated method | Chih-Kai Cheng, Cheng-Chieh Hsieh | 2017-07-18 |
| 9627223 | Methods and apparatus of packaging with interposers | Chung-Yu Lu, Hsien-Pin Hu, Hsiao-Tsung Yen, Tzuan-Horng Liu, Shang-Yun Hou +1 more | 2017-04-18 |
| 9530730 | Configurable routing for packaging applications | Chung-Yu Lu, Hsien-Pin Hu, Shin-Puu Jeng, Shang-Yun Hou, Tzuan-Horng Liu +1 more | 2016-12-27 |
| 9305808 | Methods and apparatus of packaging with interposers | Chung-Yu Lu, Hsien-Pin Hu, Hsiao-Tsung Yen, Tzuan-Horng Liu, Shang-Yun Hou +1 more | 2016-04-05 |
| 9064705 | Methods and apparatus of packaging with interposers | Chung-Yu Lu, Hsien-Pin Hu, Hsiao-Tsung Yen, Tzuan-Horng Liu, Shang-Yun Hou +1 more | 2015-06-23 |
| 8119853 | Low pressure acetylene storage | Jun Sonobe | 2012-02-21 |