| 12341011 |
Method for forming and using mask |
Ching-Yu Chang, Tze-Liang Lee |
2025-06-24 |
|
| 12322590 |
Semiconductor device and method |
Ching-Yu Chang, Tze-Liang Lee |
2025-06-03 |
|
| 12308283 |
Method for forming interconnect structure |
Chun-Kai Chen, Tze-Liang Lee |
2025-05-20 |
|
| 12217971 |
Method for forming semiconductor device |
Ching-Yu Chang, Tze-Liang Lee |
2025-02-04 |
|
| 12087644 |
Methods of determining process recipes and forming a semiconductor device |
Jung-Hau Shiu, Ching-Yu Chang, Jr-Yu Chen, Tze-Liang Lee |
2024-09-10 |
$10,912,000 |
| 11990375 |
Semiconductor Fin cutting process and structures formed thereby |
Shih-Wen Huang, Jaming Chang, Kai Hung Cheng, Chia-Hui Lin |
2024-05-21 |
$18,159,000 |
| 11887851 |
Method for forming and using mask |
Ching-Yu Chang, Tze-Liang Lee |
2024-01-30 |
$37,365,000 |
| 11854798 |
Semiconductor device and method |
Ching-Yu Chang, Tze-Liang Lee |
2023-12-26 |
$1,986,000 |
| 11842922 |
Method for forming interconnect structure |
Chun-Kai Chen, Tze-Liang Lee |
2023-12-12 |
$11,440,000 |
| 11482411 |
Semiconductor device and method |
Ching-Yu Chang, Tze-Liang Lee |
2022-10-25 |
$9,905,000 |
| 11380593 |
Semiconductor fin cutting process and structures formed thereby |
Shih-Wen Huang, Jaming Chang, Kai Hung Cheng, Chia-Hui Lin |
2022-07-05 |
$8,947,000 |
| 11101366 |
Remote plasma oxide layer |
Iwen Hsu |
2021-08-24 |
$18,306,000 |
| 10957585 |
Semiconductor device and method of forming the same |
I-Wen Hsu, Yu-Yun Peng, An-Di Sheu |
2021-03-23 |
$18,734,000 |
| 10777466 |
Semiconductor Fin cutting process and structures formed thereby |
Shih-Wen Huang, Chia-Hui Lin, Jaming Chang, Kai Hung Cheng |
2020-09-15 |
$14,838,000 |
| 10727064 |
Post UV cure for gapfill improvement |
De-Wei Yu, Chien-Hao Chen, Chih-Tang Peng, Shu-Yi Wang |
2020-07-28 |
$7,842,000 |
| 10332746 |
Post UV cure for gapfill improvement |
De-Wei Yu, Chien-Hao Chen, Chih-Tang Peng, Shu-Yi Wang |
2019-06-25 |
$8,097,000 |
| 9502305 |
Method for manufacturing CMOS transistor |
Yi-Wei Chen, Teng-Chun Tsai, Chien-Chung Huang, Tsai-Fu Hsiao |
2016-11-22 |
$102,000 |
| 9362358 |
Spatial semiconductor structure |
Hung-Lin Shih, Chih-Chien Liu, Wen-Yi Teng, Chieh-Wen Lo |
2016-06-07 |
$526,000 |
| 9343573 |
Method of fabrication transistor with non-uniform stress layer with stress concentrated regions |
Chih-Chien Liu, Tzu-Chin Wu, Yu-Shu Lin, Wen-Yi Teng |
2016-05-17 |
$201,000 |
| 9105582 |
Spatial semiconductor structure and method of fabricating the same |
Hung-Lin Shih, Chih-Chien Liu, Wen-Yi Teng, Chieh-Wen Lo |
2015-08-11 |
$120,000 |
| 9034726 |
Semiconductor process |
Chih-Chien Liu, Chia-Lung Chang, Jui-Min Lee, Yuh-Min Lin |
2015-05-19 |
$277,000 |
| 9034759 |
Method for forming interlevel dielectric (ILD) layer |
Yuh-Min Lin |
2015-05-19 |
$277,000 |
| 8951884 |
Method for forming a FinFET structure |
Hung-Lin Shih, Chih-Chien Liu, Chin-Fu Lin, Kuan-Hsien Li |
2015-02-10 |
$268,000 |
| 8937369 |
Transistor with non-uniform stress layer with stress concentrated regions |
Chih-Chien Liu, Tzu-Chin Wu, Yu-Shu Lin, Wen-Yi Teng |
2015-01-20 |
$498,000 |
| 8927388 |
Method of fabricating dielectric layer and shallow trench isolation |
Wen-Yi Teng, Chia-Lung Chang, Chih-Chien Liu |
2015-01-06 |
$230,000 |
