Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308283 | Method for forming interconnect structure | Jei-Ming Chen, Tze-Liang Lee | 2025-05-20 |
| 12227619 | Polyimide based copolymer and electronic component and field effect transistor comprising the same | Wen-Chang Chen, Mitsuru Ueda, Yan-Cheng Lin | 2025-02-18 |
| 12205824 | Patterning material including silicon-containing layer and method for semiconductor device fabrication | Szu-Ping Tung, Yi-Nien Su, Tze-Liang Lee | 2025-01-21 |
| 12183577 | Metal hard masks for reducing line bending | JeiMing Chen, Tze-Liang Lee | 2024-12-31 |
| 11842922 | Method for forming interconnect structure | Jei-Ming Chen, Tze-Liang Lee | 2023-12-12 |
| 11715640 | Patterning material including silicon-containing layer and method for semiconductor device fabrication | Szu-Ping Tung, Tze-Liang Lee, Yi-Nien Su | 2023-08-01 |
| 11049763 | Multi-patterning to form vias with straight profiles | Jung-Hau Shiu, Chia-Cheng Chou, Chung-Chi Ko, Tze-Liang Lee, Chih-Hao Chen +1 more | 2021-06-29 |
| 10867794 | Patterning method for semiconductor devices and structures resulting therefrom | Ching-Yu Chang, Jung-Hau Shiu, Szu-Ping Tung, Jen Hung Wang, Tze-Liang Lee | 2020-12-15 |
| 10510585 | Multi-patterning to form vias with straight profiles | Jung-Hau Shiu, Chia-Cheng Chou, Chung-Chi Ko, Tze-Liang Lee, Chih-Hao Chen +1 more | 2019-12-17 |
| 9679804 | Multi-patterning to form vias with straight profiles | Jung-Hau Shiu, Chia-Cheng Chou, Chung-Chi Ko, Tze-Liang Lee, Chih-Hao Chen +1 more | 2017-06-13 |