Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315726 | Semiconductor device and method | Ching-Yu Chang, Jen Hung Wang, Tze-Liang Lee | 2025-05-27 |
| 12087644 | Methods of determining process recipes and forming a semiconductor device | Ching-Yu Chang, Jei-Ming Chen, Jr-Yu Chen, Tze-Liang Lee | 2024-09-10 |
| 12074058 | Patterning methods for semiconductor devices | Wei-Ren Wang, Shing-Chyang Pan, Ching-Yu Chang, Wan-Lin Tsai, Tze-Liang Lee | 2024-08-27 |
| 11948798 | Semiconductor device and method | Ching-Yu Chang, Jen Hung Wang, Tze-Liang Lee | 2024-04-02 |
| 11676852 | Patterning methods for semiconductor devices | Wei-Ren Wang, Shing-Chyang Pan, Ching-Yu Chang, Wan-Lin Tsai, Tze-Liang Lee | 2023-06-13 |
| 11282712 | Method for preventing bottom layer wrinkling in a semiconductor device | Chung-Chi Ko, Tze-Liang Lee, Yu-Yun Peng | 2022-03-22 |
| 11069528 | Semiconductor device and method | Ching-Yu Chang, Jen Hung Wang, Tze-Liang Lee | 2021-07-20 |
| 11049763 | Multi-patterning to form vias with straight profiles | Chun-Kai Chen, Chia-Cheng Chou, Chung-Chi Ko, Tze-Liang Lee, Chih-Hao Chen +1 more | 2021-06-29 |
| 10978301 | Morphology of resist mask prior to etching | Ching-Yu Chang, Wei-Ren Wang, Shing-Chyang Pan, Tze-Liang Lee | 2021-04-13 |
| 10867794 | Patterning method for semiconductor devices and structures resulting therefrom | Ching-Yu Chang, Szu-Ping Tung, Chun-Kai Chen, Jen Hung Wang, Tze-Liang Lee | 2020-12-15 |
| 10867839 | Patterning methods for semiconductor devices | Wei-Ren Wang, Shing-Chyang Pan, Ching-Yu Chang, Wan-Lin Tsai, Tze-Liang Lee | 2020-12-15 |
| 10727045 | Method for manufacturing a semiconductor device | Wan-Lin Tsai, Ching-Yu Chang, Jen Hung Wang, Shing-Chyang Pan, Tze-Liang Lee | 2020-07-28 |
| 10515822 | Method for preventing bottom layer wrinkling in a semiconductor device | Chung-Chi Ko, Tze-Liang Lee, Yu-Yun Peng | 2019-12-24 |
| 10510585 | Multi-patterning to form vias with straight profiles | Chun-Kai Chen, Chia-Cheng Chou, Chung-Chi Ko, Tze-Liang Lee, Chih-Hao Chen +1 more | 2019-12-17 |
| 10510584 | Via patterning using multiple photo multiple etch | Chung-Chi Ko, Tze-Liang Lee, Wen-Kuo Hsieh, Yu-Yun Peng | 2019-12-17 |
| 10361112 | High aspect ratio gap fill | Wan-Lin Tsai, Shing-Chyang Pan, Sung-En Lin, Tze-Liang Lee, Jen Hung Wang | 2019-07-23 |
| 10340178 | Via patterning using multiple photo multiple etch | Chung-Chi Ko, Tze-Liang Lee, Wen-Kuo Hsieh, Yu-Yun Peng | 2019-07-02 |
| 10141220 | Via patterning using multiple photo multiple etch | Chung-Chi Ko, Tze-Liang Lee, Wen-Kuo Hsieh, Yu-Yun Peng | 2018-11-27 |
| 9754818 | Via patterning using multiple photo multiple etch | Chung-Chi Ko, Tze-Liang Lee, Wen-Kuo Hsieh, Yu-Yun Peng | 2017-09-05 |
| 9679804 | Multi-patterning to form vias with straight profiles | Chun-Kai Chen, Chia-Cheng Chou, Chung-Chi Ko, Tze-Liang Lee, Chih-Hao Chen +1 more | 2017-06-13 |
| 9412648 | Via patterning using multiple photo multiple etch | Chung-Chi Ko, Tze-Liang Lee, Wen-Kuo Hsieh, Yu-Yun Peng | 2016-08-09 |