Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798943 | Transistor source/drain contacts and methods of forming the same | Yang-Cheng Wu, Yun-Hua Chen, Huan-Just Lin | 2023-10-24 |
| 11018021 | Curing photo resist for improving etching selectivity | Tsung-Hung Chu, Ming-Chung Liang | 2021-05-25 |
| 10510584 | Via patterning using multiple photo multiple etch | Jung-Hau Shiu, Chung-Chi Ko, Tze-Liang Lee, Yu-Yun Peng | 2019-12-17 |
| 10347505 | Curing photo resist for improving etching selectivity | Tsung-Hung Chu, Ming-Chung Liang | 2019-07-09 |
| 10340178 | Via patterning using multiple photo multiple etch | Jung-Hau Shiu, Chung-Chi Ko, Tze-Liang Lee, Yu-Yun Peng | 2019-07-02 |
| 10141220 | Via patterning using multiple photo multiple etch | Jung-Hau Shiu, Chung-Chi Ko, Tze-Liang Lee, Yu-Yun Peng | 2018-11-27 |
| 9754818 | Via patterning using multiple photo multiple etch | Jung-Hau Shiu, Chung-Chi Ko, Tze-Liang Lee, Yu-Yun Peng | 2017-09-05 |
| 9728445 | Method for forming conducting via and damascene structure | Ming-Chung Liang | 2017-08-08 |
| 9412648 | Via patterning using multiple photo multiple etch | Jung-Hau Shiu, Chung-Chi Ko, Tze-Liang Lee, Yu-Yun Peng | 2016-08-09 |
| 9305839 | Curing photo resist for improving etching selectivity | Tsung-Hung Chu, Ming-Chung Liang | 2016-04-05 |
| 9123656 | Organosilicate polymer mandrel for self-aligned double patterning process | Ming-Chung Liang, Jyu-Horng Shieh | 2015-09-01 |
| 8895445 | Method of forming via holes | Marowen Ng, Ming-Chung Liang, Hsin-Yi Tsai | 2014-11-25 |
| 8470708 | Double patterning strategy for contact hole and trench in photolithography | Po-Cheng Shih, Kuan-Chen Wang, Chung-Chi Ko, Keng-Chu Lin, Tai-Yen Peng +1 more | 2013-06-25 |
| 8361684 | Method for patterning trenches with varying dimension | Hsin-Yi Tsai, Min Cao | 2013-01-29 |