Issued Patents All Time
Showing 1–25 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412775 | Isolation structures in semiconductor devices | Fu-Ting Yen, Wei-Ting Yeh, Shih-Cheng Chen | 2025-09-09 |
| 12347717 | Debonding structures for wafer bonding | Wei-Ting Yeh, Zheng-Yong Liang, De-Yang Chiou, Keng-Chu Lin | 2025-07-01 |
| 12341013 | Method and structure for barrier-less plug | Sung-Li Wang, Hung-Yi Huang, Mrunal A. Khaderbad, Chia-Hung Chu, Shuen-Shin Liang +1 more | 2025-06-24 |
| 12336214 | Inner spacers for gate-all-around semiconductor devices | Fu-Ting Yen, Ting-Ting Chen, Keng-Chu Lin, Tsu-Hsiu Perng | 2025-06-17 |
| 12315837 | Storage layers for wafer bonding | De-Yang Chiou, Fu-Ting Yen, Keng-Chu Lin | 2025-05-27 |
| 12308312 | Interconnect structure and method for manufacturing the interconnect structure | KHADERBAD MRUNAL ABHIJITH, Fu-Ting Yen, Chen-Han Wang, Tsu-Hsiu Perng, Keng-Chu Lin | 2025-05-20 |
| 12283618 | Inner spacer for semiconductor device | Fu-Ting Yen, Kuei-Lin CHAN | 2025-04-22 |
| 12255239 | Liner layer for backside contacts of semiconductor devices | Mrunal A. Khaderbad, Keng-Chu Lin | 2025-03-18 |
| 12255249 | Inner spacer structures for gate-all-around field effect transistors | Mrunal A. Khaderbad, Keng-Chu Lin | 2025-03-18 |
| 12051592 | Method and structure for barrier-less plug | Sung-Li Wang, Hung-Yi Huang, Mrunal A. Khaderbad, Chia-Hung Chu, Shuen-Shin Liang +1 more | 2024-07-30 |
| 12034075 | Device of dielectric layer | Keng-Chu Lin | 2024-07-09 |
| 11996363 | Interconnect structure including a heat dissipation layer and methods of forming the same | Keng-Chu Lin | 2024-05-28 |
| 11972974 | Self-aligned barrier for metal vias | Sung-Li Wang, Shuen-Shin Liang, Fang-Wei Lee, Chia-Hung Chu, Mrunal A. Khaderbad +1 more | 2024-04-30 |
| 11942447 | Storage layers for wafer bonding | De-Yang Chiou, Fu-Ting Yen, Keng-Chu Lin | 2024-03-26 |
| 11942358 | Low thermal budget dielectric for semiconductor devices | Mrunal A. Khaderbad, Ko-Feng Chen, Zheng-Yong Liang, Chen-Han Wang, De-Yang Chiou +1 more | 2024-03-26 |
| 11935752 | Device of dielectric layer | Chung-Chi Ko, Keng-Chu Lin | 2024-03-19 |
| 11908921 | Transistor isolation structures | Fu-Ting Yen, Keng-Chu Lin | 2024-02-20 |
| 11854796 | Semiconductor device structure with gate spacer | Guan-Yao Tu | 2023-12-26 |
| 11855214 | Inner spacers for gate-all-around semiconductor devices | Fu-Ting Yen, Ting-Ting Chen, Keng-Chu Lin, Tsu-Hsiu Perng | 2023-12-26 |
| 11837515 | Semiconductor device and method | Yin-Jie Pan | 2023-12-05 |
| 11823896 | Conductive structure formed by cyclic chemical vapor deposition | Mrunal A. Khaderbad, Keng-Chu Lin, Shuen-Shin Liang, Sung-Li Wang, Yasutoshi Okuno | 2023-11-21 |
| 11817343 | Dielectric gap fill | — | 2023-11-14 |
| 11804539 | Transistor isolation structures | Mrunal A. Khaderbad, Keng-Chu Lin | 2023-10-31 |
| 11637062 | Interconnect structure and method for manufacturing the interconnect structure | KHADERBAD MRUNAL ABHIJITH, Fu-Ting Yen, Chen-Han Wang, Tsu-Hsiu Perng, Keng-Chu Lin | 2023-04-25 |
| 11488869 | Transistor isolation structures | Mrunal A. Khaderbad, Keng-Chu Lin | 2022-11-01 |