Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412779 | Bilayer seal material for air gaps in semiconductor devices | Shuen-Shin Liang, Keng-Chu Lin, Tetsuji Ueno, Ting-Ting Chen | 2025-09-09 |
| 12376321 | Semiconductor device with silicide structures surrounding epitaxial structures and method of making the same | Keng-Chu Lin, Shuen-Shin Liang | 2025-07-29 |
| 12369388 | Semiconductor devices with tunable low-K inner air spacers | Keng-Chu Lin, Shuen-Shin Liang, Tetsuji Ueno, Ting-Ting Chen | 2025-07-22 |
| 12360153 | In-line device electrical property estimating method and test structure of the same | Chun-Hsiung Lin | 2025-07-15 |
| 12363980 | Spacer structure for semiconductor device | Ding-Kang Shih, Chun-Hsiung Lin, Teng-Chun Tsai, Zhi-Chang Lin, Akira Mineji +1 more | 2025-07-15 |
| 12324200 | Seal material for air gaps in semiconductor devices | Shuen-Shin Liang, Tetsuji Ueno, Ting-Ting Chen, Keng-Chu Lin | 2025-06-03 |
| 12308312 | Interconnect structure and method for manufacturing the interconnect structure | KHADERBAD MRUNAL ABHIJITH, Yu-Yun Peng, Fu-Ting Yen, Tsu-Hsiu Perng, Keng-Chu Lin | 2025-05-20 |
| 12119404 | Gate all around structure with additional silicon layer and method for forming the same | Pei-Hsun Wang, Chun-Hsiung Lin, Chih-Hao Wang | 2024-10-15 |
| 12094952 | Air spacer formation with a spin-on dielectric material | Ting-Ting Chen, Keng-Chu Lin, Shuen-Shin Liang, Tsu-Hsiu Perng, Tsai-Jung Ho +3 more | 2024-09-17 |
| 11942358 | Low thermal budget dielectric for semiconductor devices | Mrunal A. Khaderbad, Ko-Feng Chen, Zheng-Yong Liang, De-Yang Chiou, Yu-Yun Peng +1 more | 2024-03-26 |
| 11901220 | Bilayer seal material for air gaps in semiconductor devices | Shuen-Shin Liang, Keng-Chu Lin, Tetsuji Ueno, Ting-Ting Chen | 2024-02-13 |
| 11848238 | Methods for manufacturing semiconductor devices with tunable low-k inner air spacers | Keng-Chu Lin, Shuen-Shin Liang, Tetsuji Ueno, Ting-Ting Chen | 2023-12-19 |
| 11735666 | Gate all around structure with additional silicon layer and method for forming the same | Pei-Hsun Wang, Chun-Hsiung Lin, Chih-Hao Wang | 2023-08-22 |
| 11688766 | Seal material for air gaps in semiconductor devices | Shuen-Shin Liang, Keng-Chu Lin, Tetsuji Ueno, Ting-Ting Chen | 2023-06-27 |
| 11637062 | Interconnect structure and method for manufacturing the interconnect structure | KHADERBAD MRUNAL ABHIJITH, Yu-Yun Peng, Fu-Ting Yen, Tsu-Hsiu Perng, Keng-Chu Lin | 2023-04-25 |
| 11626482 | Air spacer formation with a spin-on dielectric material | Ting-Ting Chen, Keng-Chu Lin, Shuen-Shin Liang, Tsu-Hsiu Perng, Tsai-Jung Ho +3 more | 2023-04-11 |
| 11502166 | Seal material for air gaps in semiconductor devices | Shuen-Shin Liang, Keng-Chu Lin, Tetsuji Ueno, Ting-Ting Chen | 2022-11-15 |
| 11480606 | In-line device electrical property estimating method and test structure of the same | Chun-Hsiung Lin | 2022-10-25 |
| 11430891 | Gate all around structure with additional silicon layer and method for forming the same | Pei-Hsun Wang, Chun-Hsiung Lin, Chih-Hao Wang | 2022-08-30 |
| 11296187 | Seal material for air gaps in semiconductor devices | Shuen-Shin Liang, Keng-Chu Lin, Tetsuji Ueno, Ting-Ting Chen | 2022-04-05 |
| 11264485 | Spacer structure for semiconductor device | Ding-Kang Shih, Chun-Hsiung Lin, Teng-Chun Tsai, Zhi-Chang Lin, Akira Mineji +1 more | 2022-03-01 |
| 11257753 | Interconnect structure and method for manufacturing the interconnect structure | KHADERBAD MRUNAL ABHIJITH, Yu-Yun Peng, Fu-Ting Yen, Tsu-Hsiu Perng, Keng-Chu Lin | 2022-02-22 |
| 11063042 | Method and device of preventing merging of resist-protection-oxide (RPO) between adjacent structures | Chun-Hsiung Lin | 2021-07-13 |
| 10461079 | Method and device of preventing merging of resist-protection-oxide (RPO) between adjacent structures | Chun-Hsiung Lin | 2019-10-29 |
| 10438948 | Method and device of preventing merging of resist-protection-oxide (RPO) between adjacent structures | Chun-Hsiung Lin | 2019-10-08 |