Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12360314 | Photonic semiconductor-on-insulator (SOI) substrate and method for forming the photonic SOI substrate | Eugene Chen, Kuan-Liang Liu, Yung-Lung Lin, Chia-Shiung Tsai | 2025-07-15 |
| 12347717 | Debonding structures for wafer bonding | Wei-Ting Yeh, Zheng-Yong Liang, Yu-Yun Peng, Keng-Chu Lin | 2025-07-01 |
| 12341056 | Method of fabricating a semiconductor structure and semiconductor structure obtained therefrom | Kenichi Sano, Chung-Liang Cheng, KUANLIANG LIU, Pinyen Lin | 2025-06-24 |
| 12315837 | Storage layers for wafer bonding | Yu-Yun Peng, Fu-Ting Yen, Keng-Chu Lin | 2025-05-27 |
| 12230585 | Photolithography alignment process for bonded wafers | Yeong-Jyh Lin, Ching-I Li, Sz-Fan Chen, Han-Jui Hu, Ching-Hung Wang +2 more | 2025-02-18 |
| 11942358 | Low thermal budget dielectric for semiconductor devices | Mrunal A. Khaderbad, Ko-Feng Chen, Zheng-Yong Liang, Chen-Han Wang, Yu-Yun Peng +1 more | 2024-03-26 |
| 11942447 | Storage layers for wafer bonding | Fu-Ting Yen, Yu-Yun Peng, Keng-Chu Lin | 2024-03-26 |
| 11916022 | Photolithography alignment process for bonded wafers | Yeong-Jyh Lin, Ching-I Li, Sz-Fan Chen, Han-Jui Hu, Ching-Hung Wang +2 more | 2024-02-27 |
| 11362038 | Photolithography alignment process for bonded wafers | Yeong-Jyh Lin, Ching-I Li, Sz-Fan Chen, Han-Jui Hu, Ching-Hung Wang +2 more | 2022-06-14 |