Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12360314 | Photonic semiconductor-on-insulator (SOI) substrate and method for forming the photonic SOI substrate | Eugene Chen, Kuan-Liang Liu, De-Yang Chiou, Chia-Shiung Tsai | 2025-07-15 |
| 12315843 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu +3 more | 2025-05-27 |
| 12300670 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung +1 more | 2025-05-13 |
| 12293946 | Techniques for wafer stack processing | Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Hau-Yi Hsiao | 2025-05-06 |
| 12237165 | Method for wafer bonding including edge trimming | Hau-Yi Hsiao, Chih-Hui Huang, Kuo-Hwa Tzeng, Cheng-Hsien Chou | 2025-02-25 |
| 11984431 | 3DIC structure and methods of forming | Kuo-Ming Wu, Zhi-Yang Wang, Sheng-Chau Chen, Cheng-Hsien Chou | 2024-05-14 |
| 11951569 | Damage prevention during wafer edge trimming | Kuo-Ming Wu, Hau-Yi Hsiao, Sheng-Chau Chen, Cheng-Yuan Tsai | 2024-04-09 |
| 11842992 | Seal ring structures and methods of forming same | Kuo-Ming Wu, Kuan-Liang Liu, Wen-De Wang | 2023-12-12 |
| 11804473 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung +1 more | 2023-10-31 |
| 11587908 | 3DIC structure and methods of forming | Kuo-Ming Wu, Zhi-Yang Wang, Sheng-Chau Chen, Cheng-Hsien Chou | 2023-02-21 |
| 11545395 | Techniques for wafer stack processing | Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Hau-Yi Hsiao | 2023-01-03 |
| 11410972 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu +3 more | 2022-08-09 |
| 11342322 | Seal ring structures and methods of forming same | Kuo-Ming Wu, Kuan-Liang Liu, Wen-De Wang | 2022-05-24 |
| 11322481 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu +3 more | 2022-05-03 |
| 11127635 | Techniques for wafer stack processing | Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Hau-Yi Hsiao | 2021-09-21 |
| 11087971 | Method for manufacturing semiconductor device and manufacturing method of the same | Hau-Yi Hsiao, Chih-Hui Huang, Kuo-Hwa Tzeng, Cheng-Hsien Chou | 2021-08-10 |
| 11024602 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung +1 more | 2021-06-01 |
| 10727218 | Seal ring structures and methods of forming same | Kuo-Ming Wu, Kuan-Liang Liu, Wen-De Wang | 2020-07-28 |
| 10727205 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu +3 more | 2020-07-28 |
| 10522514 | 3DIC structure and methods of forming | Kuo-Ming Wu, Zhi-Yang Wang, Sheng-Chau Chen, Cheng-Hsien Chou | 2019-12-31 |
| 10504716 | Method for manufacturing semiconductor device and manufacturing method of the same | Hau-Yi Hsiao, Chih-Hui Huang, Kuo-Hwa Tzeng, Cheng-Hsien Chou | 2019-12-10 |
| 10453832 | Seal ring structures and methods of forming same | Kuo-Ming Wu, Kuan-Liang Liu, Wen-De Wang | 2019-10-22 |
| 10395974 | Method for forming a thin semiconductor-on-insulator (SOI) substrate | Shih Pei Chou, Hung-Wen Hsu, Jiech-Fun Lu, Yu-Hung Cheng, Min-Ying Tsai | 2019-08-27 |
| 10269770 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung +1 more | 2019-04-23 |
| 10050018 | 3DIC structure and methods of forming | Kuo-Ming Wu, Zhi-Yang Wang, Sheng-Chau Chen, Cheng-Hsien Chou | 2018-08-14 |