Issued Patents All Time
Showing 1–25 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12340987 | Tunable plasma exclusion zone in semiconductor fabrication | Che-Wei Yang, Chih-Cheng Shih, Sheng-Chan Li, Cheng-Yuan Tsai | 2025-06-24 |
| 12300670 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2025-05-13 |
| 12302663 | Bond pad structure for bonding improvement | Chin-Wei Liang, Hsun-Chung Kuang, Sheng-Chan Li | 2025-05-13 |
| 12290003 | Conductive structure connection with interconnect structure | Cheng-Tai Hsiao, Cheng-Yuan Tsai, Hsun-Chung Kuang | 2025-04-29 |
| 12278151 | Semiconductor wafer seal ring having protrusion extending into trench in semiconductor substrate | Ming-Che Lee, Kuo-Ming Wu, Hau-Yi Hsiao, Guanyu Luo, Ping-Tzu Chen +1 more | 2025-04-15 |
| 12272715 | High reflectance isolation structure to increase image sensor performance | Sheng-Chan Li, Hau-Yi Hsiao, Che-Wei Yang, Cheng-Yuan Tsai | 2025-04-08 |
| 12266579 | Method and system for adjusting the gap between a wafer and a top plate in a thin-film deposition process | Sheng-Chan Li, Cheng-Hsien Chou, Cheng-Yuan Tsai | 2025-04-01 |
| 12213323 | Embedded backside memory on a field effect transistor | Kuan-Liang Liu, Chung-Liang Cheng, Chia-Shiung Tsai, Yeong-Jyh Lin, Pinyen Lin +1 more | 2025-01-28 |
| 12205855 | Process tool for analyzing bonded workpiece interface | Hau-Yi Hsiao, Kuo-Ming Wu, Chun-Liang Chen | 2025-01-21 |
| 12183779 | Integrated circuit and method of forming the same | Ming-Che Lee, Cheng-Yuan Tsai | 2024-12-31 |
| 12185640 | MRAM MTJ with directly coupled top electrode connection | Cheng-Tai Hsiao, Cheng-Yuan Tsai, Hsun-Chung Kuang | 2024-12-31 |
| 12183761 | Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same | Cheng-Hsien Chou, Min-Feng Kao | 2024-12-31 |
| 12176372 | Dielectric structure overlying image sensor element to increase quantum efficiency | Cheng-Hsien Chou, Ming-Che Lee | 2024-12-24 |
| 12176370 | Stacked structure for CMOS image sensors including through-substrate-via contacting negative bias circuit | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Feng-Chi Hung +1 more | 2024-12-24 |
| 12125763 | Trim wall protection method for multi-wafer stacking | Sheng-Chan Li, Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu | 2024-10-22 |
| 12113090 | Bond pad structure for bonding improvement | Chin-Wei Liang, Hsun-Chung Kuang, Sheng-Chan Li | 2024-10-08 |
| 12087756 | Protective wafer grooving structure for wafer thinning and methods of using the same | Kuo-Ming Wu, Ming-Che Lee, Hau-Yi Hsiao, Cheng-Hsien Chou, Cheng-Yuan Tsai | 2024-09-10 |
| 12046550 | Three dimensional MIM capacitor having a comb structure and methods of making the same | Paul Yang, Tsun-Kai Tsao, Sheng-Chan Li, Cheng-Yuan Tsai | 2024-07-23 |
| 12027554 | Composite deep trench isolation structure in an image sensor | Che-Wei Yang, Sheng-Chan Li, Tsun-Kai Tsao, Chih-Cheng Shih, Cheng-Yuan Tsai | 2024-07-02 |
| 11984431 | 3DIC structure and methods of forming | Kuo-Ming Wu, Yung-Lung Lin, Zhi-Yang Wang, Cheng-Hsien Chou | 2024-05-14 |
| 11951569 | Damage prevention during wafer edge trimming | Kuo-Ming Wu, Yung-Lung Lin, Hau-Yi Hsiao, Cheng-Yuan Tsai | 2024-04-09 |
| 11925033 | Embedded backside memory on a field effect transistor | Kuan-Liang Liu, Chung-Liang Cheng, Chia-Shiung Tsai, Yeong-Jyh Lin, Pinyen Lin +1 more | 2024-03-05 |
| 11915977 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +3 more | 2024-02-27 |
| 11908878 | Image sensor and manufacturing method thereof | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Feng-Chi Hung +1 more | 2024-02-20 |
| 11901387 | Image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Feng-Chi Hung +1 more | 2024-02-13 |