CL

Chin-Wei Liang

TSMC: 34 patents #993 of 12,232Top 9%
AM AMD: 6 patents #1,863 of 9,279Top 25%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
📍 Zhubeikou, CA: #9 of 34 inventorsTop 30%
Overall (All Time): #71,952 of 4,157,543Top 2%
42
Patents All Time

Issued Patents All Time

Showing 1–25 of 42 patents

Patent #TitleCo-InventorsDate
12302663 Bond pad structure for bonding improvement Sheng-Chau Chen, Hsun-Chung Kuang, Sheng-Chan Li 2025-05-13
12266604 Techniques to inhibit delamination from flowable gap-fill dielectric Hsing-Lien Lin, Hsun-Chung Kuang, Ching Ju Yang 2025-04-01
12113090 Bond pad structure for bonding improvement Sheng-Chau Chen, Hsun-Chung Kuang, Sheng-Chan Li 2024-10-08
11887929 Techniques to inhibit delamination from flowable gap-fill dielectric Hsing-Lien Lin, Hsun-Chung Kuang, Ching Ju Yang 2024-01-30
11869916 Bond pad structure for bonding improvement Sheng-Chau Chen, Hsun-Chung Kuang, Sheng-Chan Li 2024-01-09
11495532 Techniques to inhibit delamination from flowable gap-fill dielectric Hsing-Lien Lin, Hsun-Chung Kuang, Ching Ju Yang 2022-11-08
11404484 Image sensors with organic photodiodes and methods for forming the same Chia-Shiung Tsai, Cheng-Yuan Tsai, Hsing-Lien Lin 2022-08-02
11348790 Apparatus and method for wafer bonding Yeong-Jyh Lin, Yeur-Luen Tu 2022-05-31
11133231 CMP apparatus and method for estimating film thickness Yu-Min Chen, Sheng-Chau Chen, Hsun-Chung Kuang 2021-09-28
11049767 Semiconductor device and methods of manufacturing thereof Tsai-Ming Huang, Wei-Chieh Huang, Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Che CHUNG +4 more 2021-06-29
11024800 Film scheme to improve peeling in chalcogenide based PCRAM Hai-Dang Trinh, Hsing-Lien Lin, Fa-Shen Jiang 2021-06-01
10967479 Chemical mechanical polishing system and method Hsun-Chung Kuang, Yen-Chang Chu 2021-04-06
10910260 Method for manufacturing semiconductor device Wei-Chieh Huang, Feng-Jia Shiu, Hsia-Wei Chen, Jieh-Jang Chen, Ching-Sen Kuo 2021-02-02
10818857 Organic photosensitive device with an electron-blocking and hole-transport layer Hsing-Lien Lin, Cheng-Yuan Tsai, Chia-Shiung Tsai 2020-10-27
10748967 Image sensors with organic photodiodes and methods for forming the same Chia-Shiung Tsai, Cheng-Yuan Tsai, Hsing-Lien Lin 2020-08-18
10636661 Apparatus and method for wafer bonding Yeong-Jyh Lin, Yeur-Luen Tu 2020-04-28
10622555 Film scheme to improve peeling in chalcogenide based PCRAM Hai-Dang Trinh, Hsing-Lien Lin, Fa-Shen Jiang 2020-04-14
10510587 Method for manufacturing semiconductor device Wei-Chieh Huang, Feng-Jia Shiu, Hsia-Wei Chen, Jieh-Jang Chen, Ching-Sen Kuo 2019-12-17
10350726 Chemical mechanical polishing system and method Hsun-Chung Kuang, Yen-Chang Chu 2019-07-16
10193065 High K scheme to improve retention performance of resistive random access memory (RRAM) Trinh Hai Dang, Hsing-Lien Lin, Cheng-Yuan Tsai, Chia-Shiung Tsai 2019-01-29
10155214 Getter, MEMS device and method of forming the same Cheng-Yuan Tsai, Chun-Wen Cheng, Chia-Shiung Tsai 2018-12-18
10115896 Semiconductor device and method of manufacturing the same Hai-Dang Trinh, Yao-Wen Chang, Cheng-Yuan Tsai, Yen-Chang Chu 2018-10-30
10008546 Image sensors with organic photodiodes and methods for forming the same Chia-Shiung Tsai, Cheng-Yuan Tsai, Hsing-Lien Lin 2018-06-26
9960353 Method of fabricating an organic photodiode with dual electron blocking layers Hsing-Lien Lin, Cheng-Yuan Tsai, Chia-Shiung Tsai 2018-05-01
9876184 Organic photosensitive device with an electron-blocking and hole-transport layer Hsing-Lien Lin, Cheng-Yuan Tsai, Chia-Shiung Tsai 2018-01-23