Issued Patents All Time
Showing 1–25 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334475 | 3D trench capacitor for integrated passive devices | Xin-Hua Huang, Chung-Yi Yu, Rei-Lin Chu | 2025-06-17 |
| 12289979 | Deposition system for high accuracy patterning | Ping-Yin Liu, Chia-Shiung Tsai, Xin-Hua Huang, Yu-Hsing Chang | 2025-04-29 |
| 12230585 | Photolithography alignment process for bonded wafers | Ching-I Li, De-Yang Chiou, Sz-Fan Chen, Han-Jui Hu, Ching-Hung Wang +2 more | 2025-02-18 |
| 12213323 | Embedded backside memory on a field effect transistor | Kuan-Liang Liu, Sheng-Chau Chen, Chung-Liang Cheng, Chia-Shiung Tsai, Pinyen Lin +1 more | 2025-01-28 |
| 11925033 | Embedded backside memory on a field effect transistor | Kuan-Liang Liu, Sheng-Chau Chen, Chung-Liang Cheng, Chia-Shiung Tsai, Pinyen Lin +1 more | 2024-03-05 |
| 11916022 | Photolithography alignment process for bonded wafers | Ching-I Li, De-Yang Chiou, Sz-Fan Chen, Han-Jui Hu, Ching-Hung Wang +2 more | 2024-02-27 |
| 11862612 | 3D trench capacitor for integrated passive devices | Xin-Hua Huang, Chung-Yi Yu, Rei-Lin Chu | 2024-01-02 |
| 11818944 | Deposition system for high accuracy patterning | Ping-Yin Liu, Chia-Shiung Tsai, Xin-Hua Huang, Yu-Hsing Chang | 2023-11-14 |
| 11688717 | Mechanical wafer alignment detection for bonding process | Ching-Hung Wang, Ching-I Li, Tzu Wei Yu, Chung-Yi Yu | 2023-06-27 |
| 11390000 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen, Ming-Da Cheng +1 more | 2022-07-19 |
| 11362038 | Photolithography alignment process for bonded wafers | Ching-I Li, De-Yang Chiou, Sz-Fan Chen, Han-Jui Hu, Ching-Hung Wang +2 more | 2022-06-14 |
| 11348790 | Apparatus and method for wafer bonding | Yeur-Luen Tu, Chin-Wei Liang | 2022-05-31 |
| 11233032 | Mechanisms for forming bonding structures | Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu | 2022-01-25 |
| 11211362 | 3D trench capacitor for integrated passive devices | Xin-Hua Huang, Chung-Yi Yu, Rei-Lin Chu | 2021-12-28 |
| 11189515 | Method for alignment, process tool and method for wafer-level alignment | Ching-Hung Wang, Ping-Yin Liu, Yeur-Luen Tu | 2021-11-30 |
| 11127725 | Semiconductor structure and associated manufacturing method | Ping-Yin Liu, Chi-Ming Chen | 2021-09-21 |
| 11024618 | Wafer-level underfill and over-molding | Bor-Ping Jang, Chung-Shi Liu, Chien Ling Hwang | 2021-06-01 |
| 10985135 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Jen-Chun Liao, Hsiao-Chung Liang, Chung-Shi Liu | 2021-04-20 |
| 10804234 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang | 2020-10-13 |
| 10770331 | Semiconductor wafer device and manufacturing method thereof | Bor-Ping Jang, Chien Ling Hwang, Hsin-Hung Liao | 2020-09-08 |
| 10734345 | Packaging through pre-formed metal pins | Chen-Hua Yu, Chien Ling Hwang | 2020-08-04 |
| 10636661 | Apparatus and method for wafer bonding | Yeur-Luen Tu, Chin-Wei Liang | 2020-04-28 |
| 10636688 | Method for alignment, process tool and method for wafer-level alignment | Ching-Hung Wang, Ping-Yin Liu, Yeur-Luen Tu | 2020-04-28 |
| 10622342 | Stacked LED structure and associated manufacturing method | Ping-Yin Liu, Chi-Ming Chen | 2020-04-14 |
| 10513070 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen, Ming-Da Cheng +1 more | 2019-12-24 |