HL

Hsiao-Chung Liang

TSMC: 13 patents #2,298 of 12,232Top 20%
📍 Baoshan, TW: #276 of 3,661 inventorsTop 8%
Overall (All Time): #373,011 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
11749582 Package structure Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Chien Ling Hwang +4 more 2023-09-05
11444002 Package structure Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Chien Ling Hwang +4 more 2022-09-13
11233032 Mechanisms for forming bonding structures Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Chung-Shi Liu 2022-01-25
10985135 Methods for controlling warpage in packaging Chien Ling Hwang, Bor-Ping Jang, Jen-Chun Liao, Yeong-Jyh Lin, Chung-Shi Liu 2021-04-20
10804234 Semiconductor device having a boundary structure, a package on package structure, and a method of making Chien Ling Hwang, Yeong-Jyh Lin, Bor-Ping Jang 2020-10-13
10510712 Methods for controlling warpage in packaging Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin, Chung-Shi Liu 2019-12-17
10504870 Mechanisms for forming bonding structures Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Chung-Shi Liu 2019-12-10
10276531 Semiconductor device having a boundary structure, a package on package structure, and a method of making Chien Ling Hwang, Yeong-Jyh Lin, Bor-Ping Jang 2019-04-30
10157881 Methods for controlling warpage in packaging Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin, Chung-Shi Liu 2018-12-18
9768142 Mechanisms for forming bonding structures Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Chung-Shi Liu 2017-09-19
9659891 Semiconductor device having a boundary structure, a package on package structure, and a method of making Chien Ling Hwang, Yeong-Jyh Lin, Bor-Ping Jang 2017-05-23
9484226 Methods for controlling warpage in packaging Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin, Chung-Shi Liu 2016-11-01
9093337 Methods for controlling warpage in packaging Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin, Chung-Shi Liu 2015-07-28