Issued Patents All Time
Showing 1–25 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406961 | Integrated circuit package and method | Chung-Shi Liu, Mao-Yen Chang, Kuo Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh +4 more | 2025-09-02 |
| 12374592 | Semiconductor device and manufacturing method thereof | Cheng-Chieh Wu, Ting Hao Kuo, Kuo Lung Pan, Po-Yuan Teng, Shu-Rong Chun +7 more | 2025-07-29 |
| 12368141 | IPD modules with flexible connection scheme in packaging | Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2025-07-22 |
| 12300571 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Pei-Hsuan Lee, Chien Ling Hwang, Tin-Hao Kuo +2 more | 2025-05-13 |
| 12300618 | Semiconductor device having a heat dissipation structure connected chip package | Po-Yuan Teng, Hung-Yi Kuo, Hao-Yi Tsai, Tin-Hao Kuo, Shih-Wei Chen | 2025-05-13 |
| 12278208 | Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin +2 more | 2025-04-15 |
| 12278199 | Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications | Chang-Pin Huang, Tung-Liang Shao, Hsien-Ming Tu, Ching-Jung Yang | 2025-04-15 |
| 12205923 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Po-Yuan Teng | 2025-01-21 |
| 12166015 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Ting Hao Kuo +3 more | 2024-12-10 |
| 12100682 | Package structure with conductive patterns in a redistribution layer | Chih-Horng Chang, Hao-Yi Tsai, Chih-Hsuan Tai | 2024-09-24 |
| 12057405 | Packages with thick RDLs and thin RDLs stacked alternatingly | Po-Yuan Teng, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu | 2024-08-06 |
| 12014976 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Teng-Yuan Lo, Mao-Yen Chang, Po-Yuan Teng, Chen-Hua Yu +3 more | 2024-06-18 |
| 11990381 | Integrated circuit packages having support rings | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee +3 more | 2024-05-21 |
| 11942451 | Semiconductor structure and method of forming the same | Mao-Yen Chang, Cheng-Shiuan Wong, Ting Hao Kuo, Ching-Hua Hsieh, Hao-Yi Tsai +2 more | 2024-03-26 |
| 11848300 | Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin +2 more | 2023-12-19 |
| 11848319 | Multi-chip semiconductor package | Kuo Lung Pan, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2023-12-19 |
| 11837562 | Conductive bump of a semiconductor device and fabricating method thereof | Chang-Pin Huang, Tung-Liang Shao, Hsien-Ming Tu, Ching-Jung Yang | 2023-12-05 |
| 11804443 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Hao-Yi Tsai +2 more | 2023-10-31 |
| 11798925 | IPD modules with flexible connection scheme in packaging | Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2023-10-24 |
| 11749582 | Package structure | Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai, Chien Ling Hwang +4 more | 2023-09-05 |
| 11646296 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Ting Hao Kuo +3 more | 2023-05-09 |
| 11646255 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu +3 more | 2023-05-09 |
| 11569202 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Po-Yuan Teng | 2023-01-31 |
| 11538735 | Method of forming integrated circuit packages with mechanical braces | Shu-Rong Chun, Kuo Lung Pan, Pei-Hsuan Lee, Chien Ling Hwang, Tin-Hao Kuo +2 more | 2022-12-27 |
| 11508665 | Packages with thick RDLs and thin RDLs stacked alternatingly | Po-Yuan Teng, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu | 2022-11-22 |