Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278199 | Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications | Tung-Liang Shao, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai | 2025-04-15 |
| 11837562 | Conductive bump of a semiconductor device and fabricating method thereof | Tung-Liang Shao, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai | 2023-12-05 |
| 11469200 | Semiconductor device and manufacturing method thereof | Tung-Liang Shao, Yu-Chia Lai, Hsien-Ming Tu, Ching-Jung Yang | 2022-10-11 |
| 10985121 | Bump structure and fabricating method thereof | Tung-Liang Shao, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai | 2021-04-20 |
| 10879198 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Yu-Chia Lai, Tung-Liang Shao | 2020-12-29 |
| 10854564 | Semiconductor device and manufacturing method thereof | Tung-Liang Shao, Yu-Chia Lai, Hsien-Ming Tu, Ching-Jung Yang | 2020-12-01 |
| 10825804 | Hollow metal pillar packaging scheme | Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai | 2020-11-03 |
| 10354986 | Hollow metal pillar packaging scheme | Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai | 2019-07-16 |
| 10269737 | Method for manufacturing semiconductor structure | Hsien-Ming Tu, Ching-Jung Yang, Shih-Wei Liang, Hung-Yi Kuo, Yu-Chia Lai +3 more | 2019-04-23 |
| 10262958 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Yu-Chia Lai, Tung-Liang Shao | 2019-04-16 |
| 10163828 | Semiconductor device and fabricating method thereof | Tung-Liang Shao, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai | 2018-12-25 |
| 10062654 | Semicondcutor structure and semiconductor manufacturing process thereof | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsien-Ming Tu, Hung-Yi Kuo +3 more | 2018-08-28 |
| 10032737 | Semiconductor device and manufacturing method thereof | Tung-Liang Shao, Yu-Chia Lai, Hsien-Ming Tu, Ching-Jung Yang | 2018-07-24 |
| 9947630 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Yu-Chia Lai, Tung-Liang Shao | 2018-04-17 |
| 9943239 | Optical sensing system and associated electronic device | Hung-Yi Kuo, Hao-Yi Tsai, Hsien-Ming Tu, Shih-Wei Liang, Chih-Hua Chen +2 more | 2018-04-17 |
| 9852985 | Conductive terminal on integrated circuit | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsien-Ming Tu, Hung-Yi Kuo +3 more | 2017-12-26 |
| 9812434 | Hollow metal pillar packaging scheme | Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai | 2017-11-07 |
| 9799615 | Package structures having height-adjusted molding members and methods of forming the same | Chung-Shi Liu, Hsien-Ming Tu, Hung-Yi Kuo, Hao-Yi Tsai, Shih-Wei Liang +2 more | 2017-10-24 |
| 9786618 | Semiconductor structure and manufacturing method thereof | Hsien-Ming Tu, Ching-Jung Yang, Shih-Wei Liang, Hung-Yi Kuo, Yu-Chia Lai +3 more | 2017-10-10 |
| 9748212 | Shadow pad for post-passivation interconnect structures | Shih-Wei Liang, Bor-Rung Su, Chien-Chia Chiu, Hsien-Ming Tu, Chun-Hung Lin +1 more | 2017-08-29 |
| 9679883 | Hollow metal pillar packaging scheme | Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai | 2017-06-13 |
| 9640498 | Integrated fan-out (InFO) package structures and methods of forming same | Chen-Hua Yu, Ching-Jung Yang, Chung-Shi Liu, Hsien-Ming Tu, Hung-Yi Kuo +3 more | 2017-05-02 |
| 9627332 | Integrated circuit structure and seal ring structure | Shih-Wei Liang, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai | 2017-04-18 |
| 9559044 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Yu-Chia Lai, Tung-Liang Shao | 2017-01-31 |
| 9484318 | Semiconductor device and manufacturing method thereof | Tung-Liang Shao, Yu-Chia Lai, Hsien-Ming Tu, Ching-Jung Yang | 2016-11-01 |