Issued Patents All Time
Showing 1–25 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341081 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Chih-Hang Tung, Sheng-Tsung Hsiao, Jen-Yu Wang | 2025-06-24 |
| 12278199 | Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai | 2025-04-15 |
| 12272616 | Heat-dissipating structures for semiconductor devices and methods of manufacture | Chen-Hua Yu, Yu-Sheng Huang, Shih-Chang Ku, Chuei-Tang Wang | 2025-04-08 |
| 12125794 | Semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Chen-Hua Yu, Su-Chun Yang, Wen-Lin Shih | 2024-10-22 |
| 12027446 | Method for forming a semiconductor component with a cooling structure | Lawrence Chiang Sheu, Chih-Hang Tung, Chen-Hua Yu, Yi-Li Hsiao | 2024-07-02 |
| 12002761 | Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Chen-Hua Yu, Su-Chun Yang, Wen-Lin Shih | 2024-06-04 |
| 11996383 | Bonded semiconductor devices and methods of forming the same | Chen-Hua Yu, Chih-Hang Tung | 2024-05-28 |
| 11996351 | Packaged semiconductor device including liquid-cooled lid and methods of forming the same | Sheng-Tsung Hsiao, Jen-Yu Wang, Chung-Jung Wu, Chih-Hang Tung | 2024-05-28 |
| 11955378 | Bonding method of package components and bonding apparatus | Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu, Su-Chun Yang | 2024-04-09 |
| 11955405 | Semiconductor package including thermal interface structures and methods of forming the same | Jen-Yu Wang, Chung-Jung Wu, Sheng-Tsung Hsiao, Chih-Hang Tung, Chen-Hua Yu | 2024-04-09 |
| 11901263 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Chih-Hang Tung, Sheng-Tsung Hsiao, Jen-Yu Wang | 2024-02-13 |
| 11837562 | Conductive bump of a semiconductor device and fabricating method thereof | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai | 2023-12-05 |
| 11631629 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Chih-Hang Tung, Sheng-Tsung Hsiao, Jen-Yu Wang | 2023-04-18 |
| 11569147 | Method of forming semiconductor package with composite thermal interface material structure | Jen-Yu Wang, Chung-Jung Wu, Chih-Hang Tung, Chen-Hua Yu | 2023-01-31 |
| 11515233 | Semiconductor component with cooling structure | Lawrence Chiang Sheu, Chih-Hang Tung, Chen-Hua Yu, Yi-Li Hsiao | 2022-11-29 |
| 11469200 | Semiconductor device and manufacturing method thereof | Yu-Chia Lai, Hsien-Ming Tu, Chang-Pin Huang, Ching-Jung Yang | 2022-10-11 |
| 11456256 | Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Chen-Hua Yu, Su-Chun Yang, Wen-Lin Shih | 2022-09-27 |
| 11443981 | Bonding method of package components and bonding apparatus | Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu, Su-Chun Yang | 2022-09-13 |
| 11410910 | Packaged semiconductor device including liquid-cooled lid and methods of forming the same | Sheng-Tsung Hsiao, Jen-Yu Wang, Chung-Jung Wu, Chih-Hang Tung | 2022-08-09 |
| 11387164 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Chih-Hang Tung, Sheng-Tsung Hsiao, Jen-Yu Wang | 2022-07-12 |
| 11342302 | Bonding with pre-deoxide process and apparatus for performing the same | Chen-Hua Yu, Ying-Jui Huang, Chih-Hang Tung, Ching-Hua Hsieh, Chien Ling Hwang +2 more | 2022-05-24 |
| 11315900 | Bonded semiconductor devices and methods of forming the same | Chen-Hua Yu, Chih-Hang Tung | 2022-04-26 |
| 11107747 | Semiconductor package with composite thermal interface material structure and method of forming the same | Jen-Yu Wang, Chung-Jung Wu, Chih-Hang Tung, Chen-Hua Yu | 2021-08-31 |
| 11101195 | Package structure and method for forming the same | Wen-Lin Shih, Su-Chun Yang, Chih-Hang Tung, Chen-Hua Yu | 2021-08-24 |
| 11056459 | Chip package structure and method for forming the same | Chih-Hang Tung, Su-Chun Yang, Geng-Ming CHANG, Chen-Hua Yu | 2021-07-06 |