Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12416951 | Electronic device including a movably connected bezel | Chi-Yu Hung, Ying Zeng | 2025-09-16 |
| 12341081 | Semiconductor device and manufacturing method thereof | Chih-Hang Tung, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang | 2025-06-24 |
| 11996351 | Packaged semiconductor device including liquid-cooled lid and methods of forming the same | Sheng-Tsung Hsiao, Jen-Yu Wang, Tung-Liang Shao, Chih-Hang Tung | 2024-05-28 |
| 11955405 | Semiconductor package including thermal interface structures and methods of forming the same | Jen-Yu Wang, Sheng-Tsung Hsiao, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu | 2024-04-09 |
| 11901263 | Semiconductor device and manufacturing method thereof | Chih-Hang Tung, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang | 2024-02-13 |
| 11811398 | Capacitance sensing device operation method | Wang-An Lin, Chun-Lun Wang | 2023-11-07 |
| 11699996 | Method for proximity sensing and applied electronic device thereof | Wang-An Lin, Ming-Che Yang, Kai Fan Hsieh | 2023-07-11 |
| 11631629 | Semiconductor device and manufacturing method thereof | Chih-Hang Tung, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang | 2023-04-18 |
| 11569147 | Method of forming semiconductor package with composite thermal interface material structure | Tung-Liang Shao, Jen-Yu Wang, Chih-Hang Tung, Chen-Hua Yu | 2023-01-31 |
| 11410910 | Packaged semiconductor device including liquid-cooled lid and methods of forming the same | Sheng-Tsung Hsiao, Jen-Yu Wang, Tung-Liang Shao, Chih-Hang Tung | 2022-08-09 |
| 11387164 | Semiconductor device and manufacturing method thereof | Chih-Hang Tung, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang | 2022-07-12 |
| 11107747 | Semiconductor package with composite thermal interface material structure and method of forming the same | Tung-Liang Shao, Jen-Yu Wang, Chih-Hang Tung, Chen-Hua Yu | 2021-08-31 |
| 9978709 | Solder bump stretching method for forming a solder bump joint in a device | Su-Chun Yang, Hsiao-Yun Chen, Yi-Li Hsiao, Chih-Hang Tung, Da-Yuan Shih +1 more | 2018-05-22 |
| 9475145 | Solder bump joint in a device including lamellar structures | Su-Chun Yang, Hsiao-Yun Chen, Yi-Li Hsiao, Chih-Hang Tung, Da-Yuan Shih +1 more | 2016-10-25 |
| 8870403 | Handheld electronic device and flashlight module | Meng-Han Tsai | 2014-10-28 |