Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027446 | Method for forming a semiconductor component with a cooling structure | Tung-Liang Shao, Lawrence Chiang Sheu, Chih-Hang Tung, Chen-Hua Yu | 2024-07-02 |
| 11955378 | Bonding method of package components and bonding apparatus | Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang | 2024-04-09 |
| 11515233 | Semiconductor component with cooling structure | Tung-Liang Shao, Lawrence Chiang Sheu, Chih-Hang Tung, Chen-Hua Yu | 2022-11-29 |
| 11443981 | Bonding method of package components and bonding apparatus | Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang | 2022-09-13 |
| 11348889 | Semiconductor device and bump formation process | Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei | 2022-05-31 |
| 11342302 | Bonding with pre-deoxide process and apparatus for performing the same | Chen-Hua Yu, Ying-Jui Huang, Chih-Hang Tung, Tung-Liang Shao, Ching-Hua Hsieh +2 more | 2022-05-24 |
| 10522491 | Semiconductor device and bump formation process | Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei | 2019-12-31 |
| 10229901 | Immersion interconnections for semiconductor devices and methods of manufacture thereof | Tung-Liang Shao, Hsiao-Yun Chen, Chih-Hang Tung, Chen-Hua Yu | 2019-03-12 |
| 10163835 | Solder bump stretching method | Su-Chun Yang, Chih-Hang Tung, Chen-Hua Yu | 2018-12-25 |
| 10147693 | Methods for stud bump formation | Chien Ling Hwang, Yeong-Jyh Lin, Ming-Da Cheng, Tsai-Tsung Tsai, Chung-Shi Liu +2 more | 2018-12-04 |
| 10034390 | Metal post bonding using pre-fabricated metal posts | Su-Chun Yang, Chih-Hang Tung, Da-Yuan Shih, Chen-Hua Yu | 2018-07-24 |
| 9978709 | Solder bump stretching method for forming a solder bump joint in a device | Su-Chun Yang, Chung-Jung Wu, Hsiao-Yun Chen, Chih-Hang Tung, Da-Yuan Shih +1 more | 2018-05-22 |
| 9966357 | Pick-and-place tool for packaging process | Chien Ling Hwang, Ying-Jui Huang | 2018-05-08 |
| 9960134 | Semiconductor device and bump formation process | Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei | 2018-05-01 |
| 9893046 | Thinning process using metal-assisted chemical etching | Su-Chun Yang, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu | 2018-02-13 |
| 9842817 | Solder bump stretching method and device for performing the same | Su-Chun Yang, Chih-Hang Tung, Chen-Hua Yu | 2017-12-12 |
| 9700950 | Innovative multi-purpose dipping plate | Bor-Ping Jang, Lin-Wei Wang, Ying-Jui Huang, Chien Ling Hwang, Chung-Shi Liu | 2017-07-11 |
| 9521795 | Two-step direct bonding processes and tools for performing the same | Da-Yuan Shih, Chih-Hang Tung, Chen-Hua Yu | 2016-12-13 |
| 9498851 | Methods for forming apparatus for stud bump formation | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Chung-Shi Liu, Mirng-Ji Lii +1 more | 2016-11-22 |
| 9475145 | Solder bump joint in a device including lamellar structures | Su-Chun Yang, Chung-Jung Wu, Hsiao-Yun Chen, Chih-Hang Tung, Da-Yuan Shih +1 more | 2016-10-25 |
| 9455183 | Semiconductor device and bump formation process | Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei | 2016-09-27 |
| 9343436 | Stacked package and method of manufacturing the same | Li-Yen Lin, Chih-Hang Tung | 2016-05-17 |
| 9324670 | Semiconductor device with copper-tin compound on copper connector | Chien Ling Hwang, Chung-Shi Liu | 2016-04-26 |
| 9263407 | Method for manufacturing a plurality of metal posts | Su-Chun Yang, Chih-Hang Tung, Da-Yuan Shih, Chen-Hua Yu | 2016-02-16 |
| 9216469 | Indirect printing bumping method for solder ball deposition | Da-Yuan Shih, Chih-Hang Tung, Chen-Hua Yu | 2015-12-22 |