Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394736 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2025-08-19 |
| 11901319 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2024-02-13 |
| 11776945 | Package-on-package structure including a thermal isolation material | Meng-Tse Chen, Kuei-Wei Huang, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2023-10-03 |
| 11075131 | Semiconductor package and method of forming the same | Yi-Da Tsai, Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Chieh Yang, Chia-Min Lin | 2021-07-27 |
| 11056474 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2021-07-06 |
| 10985122 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2021-04-20 |
| 10510697 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2019-12-17 |
| 10490539 | Package on-package structure including a thermal isolation material and method of forming the same | Meng-Tse Chen, Kuei-Wei Huang, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2019-11-26 |
| 10147693 | Methods for stud bump formation | Chien Ling Hwang, Yeong-Jyh Lin, Yi-Li Hsiao, Ming-Da Cheng, Chung-Shi Liu +2 more | 2018-12-04 |
| 10134717 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-11-20 |
| 10032734 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2018-07-24 |
| 9530762 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2016-12-27 |
| 9449908 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2016-09-20 |
| 9418971 | Package-on-package structure including a thermal isolation material and method of forming the same | Meng-Tse Chen, Kuei-Wei Huang, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2016-08-16 |
| 9385040 | Method of manufacturing a semiconductor device | Wen-Hsiung Lu, Yu-Peng Tsai, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-07-05 |
| 9021682 | Apparatus for stud bump formation | Chien Ling Hwang, Yeong-Jyh Lin, Yi-Li Hsiao, Ming-Da Cheng, Chung-Shi Liu +2 more | 2015-05-05 |
| 8900922 | Fine-pitch package-on-package structures and methods for forming the same | Cheng-Chung Lin, Kuei-Wei Huang, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2014-12-02 |
| 8846448 | Warpage control in a package-on-package structure | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Ai-Tee Ang, Ming-Da Cheng +1 more | 2014-09-30 |
| 7446068 | Composition of dielectric material | Yiling WANG, Wenjun Wu, Meyiu Zhao, Wei Li, Akira Sawasaki | 2008-11-04 |