Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142594 | Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices | Kuei-Wei Huang, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2024-11-12 |
| 11776945 | Package-on-package structure including a thermal isolation material | Meng-Tse Chen, Kuei-Wei Huang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu | 2023-10-03 |
| 11532498 | Package-on-package structure | Chih-Wei Lin, Hui-Min Huang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2022-12-20 |
| 11355471 | System for processing semiconductor devices | Kuei-Wei Huang, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2022-06-07 |
| 11239103 | Package-on-package structure | Chih-Wei Lin, Hui-Min Huang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2022-02-01 |
| 10867953 | Manufacturing method of integrated fan-out package | Shing-Chao Chen, Ching-Hua Hsieh, Chih-Wei Lin, Ching-Yao Lin | 2020-12-15 |
| 10734263 | Semiconductor processing boat design with pressure sensor | Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2020-08-04 |
| 10622240 | Package on-package structure | Chih-Wei Lin, Hui-Min Huang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2020-04-14 |
| 10490539 | Package on-package structure including a thermal isolation material and method of forming the same | Meng-Tse Chen, Kuei-Wei Huang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu | 2019-11-26 |
| 10475679 | Semiconductor processing boat design with pressure sensor | Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2019-11-12 |
| 10276537 | Integrated fan-out package and manufacturing method thereof | Shing-Chao Chen, Ching-Hua Hsieh, Chih-Wei Lin, Ching-Yao Lin | 2019-04-30 |
| 10109612 | Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices | Kuei-Wei Huang, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-10-23 |
| 9911633 | Semiconductor processing boat design with pressure sensor | Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-03-06 |
| 9888527 | Systems for processing semiconductor devices, and methods of processing semiconductor devices | Hsiu-Jen Lin, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2018-02-06 |
| 9768048 | Package on-package structure | Chih-Wei Lin, Hui-Min Huang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9576888 | Package on-package joint structure with molding open bumps | Meng-Tse Chen, Chun-Cheng Lin, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-02-21 |
| 9437564 | Interconnect structure and method of fabricating same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-09-06 |
| 9427818 | Semiconductor processing boat design with pressure sensor | Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-08-30 |
| 9418971 | Package-on-package structure including a thermal isolation material and method of forming the same | Meng-Tse Chen, Kuei-Wei Huang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu | 2016-08-16 |
| 9373603 | Reflow process and tool | Hsiu-Jen Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-06-21 |
| 8900922 | Fine-pitch package-on-package structures and methods for forming the same | Cheng-Chung Lin, Kuei-Wei Huang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu | 2014-12-02 |
| 8853002 | Methods for metal bump die assembly | Hsiu-Jen Lin, Yu-Jen Tseng, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2014-10-07 |
| 8846448 | Warpage control in a package-on-package structure | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Tsai-Tsung Tsai, Ming-Da Cheng +1 more | 2014-09-30 |