Issued Patents All Time
Showing 1–25 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1094315 | Fuse socket | — | 2025-09-23 |
| 12278208 | Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo +2 more | 2025-04-15 |
| 12149024 | Electrical connector assembly | Shy-Luen Chern, Chih-Hsiang Tang, Hong-Wen Lee | 2024-11-19 |
| 12057359 | Semiconductor package and method of fabricating the same | Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin | 2024-08-06 |
| 12016167 | Tear-drop shaped HDD carrier EMI finger | Yu-Lin Chen, Yueh-Chun Tsai, Chi-Feng Lee | 2024-06-18 |
| 11940388 | Method for improving usability and accuracy for physiological measurement | Yenyu Chen, An-Cheng Chang, Tai I Chen, Su Tung Yang, Chih-Jung Hsu +2 more | 2024-03-26 |
| 11848300 | Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo +2 more | 2023-12-19 |
| 11456226 | Semiconductor package and method of fabricating the same | Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin | 2022-09-27 |
| 11424213 | Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo +2 more | 2022-08-23 |
| 11322421 | Package structure and method of forming the same | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo +2 more | 2022-05-03 |
| 11163343 | Flexible power supply unit (PSU) bay | Yu-Lin Chen, Yueh-Chun Tsai, Jen-Chun Hsueh | 2021-11-02 |
| 11158605 | Semiconductor packaging structure and method | Chung-Shi Liu, Kuei-Wei Huang, Cheng-Ting Chen, Wei-Hung Lin, Ming-Da Cheng | 2021-10-26 |
| 10879192 | Semiconductor structure and manufacturing method thereof | Hsaing-Pin Kuan, Ching-Hua Hsieh, Chih-Wei Lin, Yu-Wei Lin, Chun-Yen Lan | 2020-12-29 |
| 10832999 | Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates | Kuei-Wei Huang, Wei-Hung Lin, Chih-Wei Lin, Meng-Tse Chen, Ming-Da Cheng +1 more | 2020-11-10 |
| 10721835 | Information handling system with an adjustable guide for peripheral cards | Yu-Lin Chen, Kuang-Jye Tuan | 2020-07-21 |
| 10636715 | Semiconductor package and method of fabricating the same | Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin | 2020-04-28 |
| 10522452 | Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates | Kuei-Wei Huang, Wei-Hung Lin, Chih-Wei Lin, Meng-Tse Chen, Ming-Da Cheng +1 more | 2019-12-31 |
| 10215439 | Rotatable air flow guides for cooling information handling system components | Yenlin WANG, Chih Min Su, Chun-Chin WEN, Hsiang-Jung Chin | 2019-02-26 |
| 10172252 | Information handling system having an ergonomic plunger for a server planar board | Yu-Lin Chen, Liang Ma | 2019-01-01 |
| 10165668 | Heat exchanger for an information handling system | Brandon J. Brocklesby, Yu-Lin Chen | 2018-12-25 |
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Bor-Ping Jang, Ming-Da Cheng +6 more | 2018-11-20 |
| 9978716 | Package structure and method for manufacturing the same | Chih-Chiang Tsao, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2018-05-22 |
| 9892962 | Wafer level chip scale package interconnects and methods of manufacture thereof | Cheng-Tar Wu, Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Ming-Da Cheng | 2018-02-13 |
| 9799631 | Semiconductor packaging structure and method | Chung-Shi Liu, Kuei-Wei Huang, Cheng-Ting Chen, Wei-Hung Lin, Ming-Da Cheng | 2017-10-24 |
| 9786622 | Semiconductor package | Ming-Da Cheng, Chih-Wei Lin, Kuei-Wei Huang, Yu-Peng Tsai, Chung-Shi Liu | 2017-10-10 |