Issued Patents All Time
Showing 1–25 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412817 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2025-09-09 |
| 12406961 | Integrated circuit package and method | Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Hao-Yi Tsai, Ching-Hua Hsieh +4 more | 2025-09-02 |
| 12388060 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Ting Hao Kuo, Hao-Yi Tsai, Hsiu-Jen Lin, Hao-Jan Pei +1 more | 2025-08-12 |
| 12374592 | Semiconductor device and manufacturing method thereof | Cheng-Chieh Wu, Ting Hao Kuo, Po-Yuan Teng, Yu-Chia Lai, Shu-Rong Chun +7 more | 2025-07-29 |
| 12322706 | Chip package and method of forming the same | Hao-Yi Tsai, Tin-Hao Kuo | 2025-06-03 |
| 12300571 | Integrated circuit package and method | Shu-Rong Chun, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai, Tin-Hao Kuo +2 more | 2025-05-13 |
| 12278208 | Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2025-04-15 |
| 12255174 | Bonding passive devices on active dies to form 3D packages | Chen-Hua Yu, Shu-Rong Chun, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2025-03-18 |
| 12199051 | Integrated circuit structure and method | Chen-Hua Yu, Tin-Hao Kuo, Hao-Yi Tsai | 2025-01-14 |
| 12166015 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Ting Hao Kuo, Yu-Chia Lai +3 more | 2024-12-10 |
| 12057405 | Packages with thick RDLs and thin RDLs stacked alternatingly | Po-Yuan Teng, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu | 2024-08-06 |
| 12051666 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Sen-Kuei Hsu, Tin-Hao Kuo, Yi-Yang Lei +2 more | 2024-07-30 |
| 12014979 | Methods of forming semiconductor packages | Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang, Tin-Hao Kuo +1 more | 2024-06-18 |
| 12014976 | Chip package structure including a silicon substrate interposer and methods for forming the same | Yu-Chia Lai, Teng-Yuan Lo, Mao-Yen Chang, Po-Yuan Teng, Chen-Hua Yu +3 more | 2024-06-18 |
| 12009281 | Package structure and method of manufacturing the same | Shih-Wei Chen, Hao-Yi Tsai, Tin-Hao Kuo, Po-Yuan Teng, Chi-Hui Lai | 2024-06-11 |
| 11990381 | Integrated circuit packages having support rings | Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2024-05-21 |
| 11942451 | Semiconductor structure and method of forming the same | Mao-Yen Chang, Yu-Chia Lai, Cheng-Shiuan Wong, Ting Hao Kuo, Ching-Hua Hsieh +2 more | 2024-03-26 |
| 11848319 | Multi-chip semiconductor package | Yu-Chia Lai, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2023-12-19 |
| 11848300 | Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2023-12-19 |
| 11837575 | Bonding passive devices on active device dies to form 3D packages | Chen-Hua Yu, Shu-Rong Chun, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2023-12-05 |
| 11804443 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Yu-Chia Lai, Hao-Yi Tsai +2 more | 2023-10-31 |
| 11764171 | Integrated circuit structure and method | Chen-Hua Yu, Tin-Hao Kuo, Hao-Yi Tsai | 2023-09-19 |
| 11749582 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai +4 more | 2023-09-05 |
| 11694966 | Chip package and method of forming the same | Hao-Yi Tsai, Tin-Hao Kuo | 2023-07-04 |
| 11646296 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Ting Hao Kuo, Yu-Chia Lai +3 more | 2023-05-09 |