Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12391033 | Lamination process, and manufacturing method of semiconductor package using a chuck | Wei Huang, Yu-Ching Lo, Ching-Pin Yuan, Wen-Chih Lin, Cheng-Yu Kuo +1 more | 2025-08-19 |
| 12381176 | Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Hung-Jui Kuo +1 more | 2025-08-05 |
| 12051666 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Sen-Kuei Hsu, Tin-Hao Kuo +2 more | 2024-07-30 |
| 11993066 | Chuck, lamination process, and manufacturing method of semiconductor package using the same | Wei Huang, Yu-Ching Lo, Ching-Pin Yuan, Wen-Chih Lin, Cheng-Yu Kuo +1 more | 2024-05-28 |
| 11878388 | Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same | Kuan-Cheng Wang, Ching-Hua Hsieh | 2024-01-23 |
| 11742317 | Process including a re-etching process for forming a semiconductor structure | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Hung-Jui Kuo +1 more | 2023-08-29 |
| 11587902 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Hung-Jui Kuo +1 more | 2023-02-21 |
| 11569183 | Package structure and method of fabricating the same | Cheng-Yu Kuo, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Wei Huang | 2023-01-31 |
| 11355466 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Sen-Kuei Hsu, Tin-Hao Kuo +2 more | 2022-06-07 |
| 11270921 | Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof | Hao-Cheng Hou, Chien-Hsun Lee, Chung-Shi Liu, Jung Wei Cheng, Tsung-Ding Wang | 2022-03-08 |
| 11069652 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang, Ching-Hua Hsieh +9 more | 2021-07-20 |
| 10867939 | Package structure and method of fabricating the same | Cheng-Yu Kuo, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Wei Huang | 2020-12-15 |
| 10790252 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Szu-Yu Yeh, Yu-Ren Chen, Hung-Jui Kuo, Chung-Shi Liu | 2020-09-29 |
| 10535629 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang, Ching-Hua Hsieh +9 more | 2020-01-14 |
| 10522501 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Hung-Jui Kuo +1 more | 2019-12-31 |
| 10269747 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Szu-Yu Yeh, Yu-Ren Chen, Hung-Jui Kuo, Chung-Shi Liu | 2019-04-23 |
| 10163849 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang, Ching-Hua Hsieh +9 more | 2018-12-25 |
| 9799625 | Semiconductor structure and manufacturing method thereof | Alexander Kalnitsky, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang, Ching-Hua Hsieh +9 more | 2017-10-24 |
| 8748306 | Cleaning residual molding compound on solder bumps | Hung-Jui Kuo, Chung-Shi Liu, Mirng-Ji Lii, Chen-Hua Yu | 2014-06-10 |
| 8501613 | UBM etching methods for eliminating undercut | Hung-Jui Kuo, Chung-Shi Liu, Mirng-Ji Lii, Chen-Hua Yu | 2013-08-06 |
| 8389397 | Method for reducing UBM undercut in metal bump structures | Hung-Jui Kuo, Chung-Shi Liu | 2013-03-05 |
| 8258055 | Method of forming semiconductor die | Chien Ling Hwang, Ying-Jui Huang, Zheng-Yi Lim, Cheng-Chung Lin, Chung-Shi Liu | 2012-09-04 |