Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11768786 | Connection interface conversion chip, connection interface conversion device and operation method | Hsiao-Chyi Lin, Yi-Shing Lin, Chien-Sheng Chen | 2023-09-26 |
| 11386030 | Connection interface conversion chip, connection interface conversion device and operation method | Hsiao-Chyi Lin, Yi-Shing Lin, Chien-Sheng Chen | 2022-07-12 |
| 11270052 | System and method of timing characterization for semiconductor circuit | Chia Hao Tu, Hsueh-Chih Chou, Sang Hoo Dhong, Jerry Chang Jui Kao, Chi-Lin Liu +1 more | 2022-03-08 |
| 11176074 | Chip and interface conversion device | Yun LIU, Hsiao-Chyi Lin, Shao-Yu Chen | 2021-11-16 |
| 10824784 | System and method of timing characterization for semiconductor circuit | Chia Hao Tu, Hsueh-Chih Chou, Sang Hoo Dhong, Jerry Chang Jui Kao, Chi-Lin Liu +1 more | 2020-11-03 |
| 9846755 | Method for cell placement in semiconductor layout and system thereof | Ming-Zhang Kuo, Lee-Chung Lu, Li-Chun Tien, Sang Hoo Dhong, Ta-Pen Guo | 2017-12-19 |
| 9679915 | Integrated circuit with well and substrate contacts | Ming-Zhang Kuo, Ho-Chieh Hsieh, Hui-Zhong Zhuang, Kuo-Feng TSENG, Lee-Chung Lu +1 more | 2017-06-13 |
| 9495495 | Scan cell assignment | Ming-Zhang Kuo, Sang Hoo Dhong, Ho-Chieh Hsieh, Kuo-Feng TSENG | 2016-11-15 |
| 9449931 | Pillar bumps and process for making same | Chung-Shi Liu, Meng-Wei Chou, Kuo-Cheng Lin, Wen-Hsiung Lu, Chien Ling Hwang +2 more | 2016-09-20 |
| 9378926 | Electron beam lithography methods including time division multiplex loading | Ming-Zhang Kuo, Ping-Lin Yang, Osamu Takahashi, Sang Hoo Dhong | 2016-06-28 |
| 9362899 | Clock regenerator | Ming-Zhang Kuo, Ping-Lin Yang, Osamu Takahashi, Sang Hoo Dhong | 2016-06-07 |
| 9287171 | Method of making a conductive pillar bump with non-metal sidewall protection structure | Yi-Wen Wu, Chien Ling Hwang, Chung-Shi Liu | 2016-03-15 |
| 9286970 | Memory circuit for pre-charging and write driving | Ming-Zhang Kuo, Ho-Chieh Hsieh, Kuo-Feng TSENG, Sang Hoo Dhong | 2016-03-15 |
| 9281288 | System and method for fine pitch PoP structure | Hsiu-Jen Lin, Cheng-Ting Chen, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-03-08 |
| 9202662 | Charged particle lithography system with a long shape illumination beam | Jimmy Hsiao, Ming-Zhang Kuo, Ping-Lin Yang, Osamu Takahashi, Sang Hoo Dhong | 2015-12-01 |
| 8941085 | Electron beam lithography systems and methods including time division multiplex loading | Ming-Zhang Kuo, Ping-Lin Yang, Osamu Takahashi, Sang Hoo Dhong | 2015-01-27 |
| 8900922 | Fine-pitch package-on-package structures and methods for forming the same | Kuei-Wei Huang, Ai-Tee Ang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu | 2014-12-02 |
| 8823166 | Pillar bumps and process for making same | Chung-Shi Liu, Meng-Wei Chou, Kuo-Cheng Lin, Wen-Hsiung Lu, Chien Ling Hwang +2 more | 2014-09-02 |
| 8823167 | Copper pillar bump with non-metal sidewall protection structure and method of making the same | Yi-Wen Wu, Chien Ling Hwang, Chung-Shi Liu | 2014-09-02 |
| 8674496 | System and method for fine pitch PoP structure | Hsiu-Jen Lin, Cheng-Ting Chen, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu | 2014-03-18 |
| 8609526 | Preventing UBM oxidation in bump formation processes | Chung-Shi Liu, Ming-Che Ho, Kuo-Cheng Lin, Meng-Wei Chou | 2013-12-17 |
| 8592300 | Interface structure for copper-copper peeling integrity | Chung-Sui Liu, Chen-Hua Yu | 2013-11-26 |
| 8560997 | Conditional cell placement | Ping-Lin Yang, Ming-Zhang Kuo, Jimmy Hsiao, Jia-Rong Hsu | 2013-10-15 |
| 8441124 | Cu pillar bump with non-metal sidewall protection structure | Yi-Wen Wu, Chien Ling Hwang, Chung-Shi Liu | 2013-05-14 |
| 8432259 | Picking system | Chun-Hui Huang, Hsien-Min Hsu, Chih-Lung Liu | 2013-04-30 |