Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300592 | Fan-out package with controllable standoff | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2025-05-13 |
| 12199084 | Fan-out package with cavity substrate | Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Shin-Puu Jeng, Meng-Liang Lin | 2025-01-14 |
| 12191261 | Semiconductor device including electromagnetic interference (EMI) shielding and method of manufacture | Po-Yao Chuang, Shin-Puu Jeng | 2025-01-07 |
| 12170274 | Semiconductor packages and methods of forming same | Shin-Puu Jeng, Techi Wong, Po-Yao Chuang, Shuo-Mao Chen | 2024-12-17 |
| 12094728 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2024-09-17 |
| 12074104 | Integrated circuit packages with ring-shaped substrates | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2024-08-27 |
| 11901307 | Semiconductor device including electromagnetic interference (EMI) shielding and method of manufacture | Po-Yao Chuang, Shin-Puu Jeng | 2024-02-13 |
| 11855059 | Fan-out package with cavity substrate | Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Shin-Puu Jeng, Meng-Liang Lin | 2023-12-26 |
| 11854955 | Fan-out package with controllable standoff | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2023-12-26 |
| 11699598 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2023-07-11 |
| 11682599 | Chip package structure with molding layer and method for forming the same | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2023-06-20 |
| 11527474 | Integrated circuit package and method | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2022-12-13 |
| 11380666 | Fan-out package with cavity substrate | Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Shin-Puu Jeng, Meng-Liang Lin | 2022-07-05 |
| 11296065 | Semiconductor packages and methods of forming same | Shin-Puu Jeng, Techi Wong, Po-Yao Chuang, Shuo-Mao Chen | 2022-04-05 |
| 11075151 | Fan-out package with controllable standoff | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2021-07-27 |
| 10867811 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2020-12-15 |
| 10804254 | Fan-out package with cavity substrate | Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Shin-Puu Jeng, Meng-Liang Lin | 2020-10-13 |
| 10790162 | Integrated circuit package and method | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2020-09-29 |
| 10304700 | Semiconductor device and method | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Shih-Hao Liao, Chen-Cheng Kuo +3 more | 2019-05-28 |
| 10128206 | Conductive pillar structure | Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Hung-Jui Kuo, Chung-Shi Liu | 2018-11-13 |
| 9449931 | Pillar bumps and process for making same | Cheng-Chung Lin, Chung-Shi Liu, Kuo-Cheng Lin, Wen-Hsiung Lu, Chien Ling Hwang +2 more | 2016-09-20 |
| 8865585 | Method of forming post passivation interconnects | Hung-Jui Kuo, Ming-Che Ho, Chung-Shi Liu | 2014-10-21 |
| 8823166 | Pillar bumps and process for making same | Cheng-Chung Lin, Chung-Shi Liu, Kuo-Cheng Lin, Wen-Hsiung Lu, Chien Ling Hwang +2 more | 2014-09-02 |
| 8609526 | Preventing UBM oxidation in bump formation processes | Chung-Shi Liu, Cheng-Chung Lin, Ming-Che Ho, Kuo-Cheng Lin | 2013-12-17 |