Issued Patents All Time
Showing 1–25 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374595 | Package system and manufacturing method thereof | Pei-Hsuan Lee, Ching-Hua Hsieh | 2025-07-29 |
| 12300571 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Pei-Hsuan Lee, Yu-Chia Lai, Tin-Hao Kuo +2 more | 2025-05-13 |
| 12300659 | Aligning bumps in fan-out packaging process | Ying-Jui Huang, Chih-Wei Lin, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu | 2025-05-13 |
| 12176279 | Package structure and manufacturing method thereof | Sung-Yueh Wu, Jen-Chun Liao, Ching-Hua Hsieh, Pei-Hsuan Lee, Chia-Hung Liu | 2024-12-24 |
| 12062832 | Electronic device and manufacturing method thereof | Pei-Hsuan Lee, Ching-Hua Hsieh, Yu-Ting Chiu, Jui-Chang Kuo | 2024-08-13 |
| 12040255 | Semiconductor package and manufacturing method thereof | Jen-Chun Liao, Sung-Yueh Wu, Ching-Hua Hsieh | 2024-07-16 |
| 12040247 | Package system and manufacturing method thereof | Pei-Hsuan Lee, Ching-Hua Hsieh | 2024-07-16 |
| 12027494 | Semiconductor device and manufacturing method thereof | Hao-Yi Tsai, Tzuan-Horng Liu | 2024-07-02 |
| 11990381 | Integrated circuit packages having support rings | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee +3 more | 2024-05-21 |
| 11955349 | Anisotropic carrier for high aspect ratio fanout | Chen-Hua Yu | 2024-04-09 |
| 11764127 | Semiconductor package and manufacturing method thereof | Jen-Chun Liao, Sung-Yueh Wu, Ching-Hua Hsieh | 2023-09-19 |
| 11756872 | Package structure and manufacturing method thereof | Sung-Yueh Wu, Jen-Chun Liao, Ching-Hua Hsieh, Pei-Hsuan Lee, Chia-Hung Liu | 2023-09-12 |
| 11749582 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai +4 more | 2023-09-05 |
| 11721555 | Method and system for thinning wafer thereof | Bor-Ping Jang, Hsin-Hung Liao, Chung-Shi Liu | 2023-08-08 |
| 11631652 | Method and apparatus for bonding semiconductor substrate | Ying-Jui Huang, Ching-Hua Hsieh, Chia-Sheng Huang | 2023-04-18 |
| 11538735 | Method of forming integrated circuit packages with mechanical braces | Shu-Rong Chun, Kuo Lung Pan, Pei-Hsuan Lee, Yu-Chia Lai, Tin-Hao Kuo +2 more | 2022-12-27 |
| 11532551 | Semiconductor package with chamfered semiconductor device | Chung-Shi Liu, Ching-Hua Hsieh, Chen-Hua Yu, Hsin-Hung Liao, Sung-Yueh Wu | 2022-12-20 |
| 11502013 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee +3 more | 2022-11-15 |
| 11444002 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai +4 more | 2022-09-13 |
| 11410953 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Hung-Jui Kuo, Chung-Shi Liu | 2022-08-09 |
| 11393701 | Anisotropic carrier for high aspect ratio fanout | Chen-Hua Yu | 2022-07-19 |
| 11390000 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chung-Shi Liu, Meng-Tse Chen, Ming-Da Cheng +1 more | 2022-07-19 |
| 11342302 | Bonding with pre-deoxide process and apparatus for performing the same | Chen-Hua Yu, Ying-Jui Huang, Chih-Hang Tung, Tung-Liang Shao, Ching-Hua Hsieh +2 more | 2022-05-24 |
| 11289418 | Package structure and manufacturing method thereof | Chun-Lin Lu, Kai-Chiang Wu | 2022-03-29 |
| 11282810 | Integrated fan-out package and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2022-03-22 |