Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266847 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Yu-Sheng Hsieh | 2025-04-01 |
| 12057415 | Semiconductor device having antenna and manufacturing method thereof | Ching-Hua Hsieh, Chao-Wen Shih, Han-Ping Pu, Meng-Tse Chen, Sheng-Hsiang Chiu | 2024-08-06 |
| 11855333 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Yu-Sheng Hsieh | 2023-12-26 |
| 11705409 | Semiconductor device having antenna on chip package and manufacturing method thereof | Ching-Hua Hsieh, Chao-Wen Shih, Han-Ping Pu, Meng-Tse Chen, Sheng-Hsiang Chiu | 2023-07-18 |
| 11515618 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Yu-Sheng Hsieh | 2022-11-29 |
| 11335655 | Package structure and manufacturing method thereof | Chao-Wen Shih, Shou-Zen Chang, Nan-Chin Chuang | 2022-05-17 |
| 11282810 | Integrated fan-out package and manufacturing method thereof | Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu +5 more | 2022-03-22 |
| 10978782 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Yu-Sheng Hsieh | 2021-04-13 |
| 10879197 | Package structure and method of fabricating package structure | Chung-Shi Liu, Chao-Wen Shih, Han-Ping Pu, Chien Ling Hwang | 2020-12-29 |
| 10872842 | Semiconductor device and manufacturing method thereof | Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan +1 more | 2020-12-22 |
| 10867882 | Semiconductor package, semiconductor device and method for packaging semiconductor device | Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan, Sen-Kuei Hsu | 2020-12-15 |
| 10867940 | Package structure and manufacturing method thereof | Chao-Wen Shih, Shou-Zen Chang, Nan-Chin Chuang | 2020-12-15 |
| 10756052 | Method of manufacturing integrated fan-out package | Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu +5 more | 2020-08-25 |
| 10741508 | Semiconductor device having antenna and manufacturing method thereof | Ching-Hua Hsieh, Chao-Wen Shih, Han-Ping Pu, Meng-Tse Chen, Sheng-Hsiang Chiu | 2020-08-11 |
| 10636713 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Yu-Sheng Hsieh | 2020-04-28 |
| 10490479 | Packaging of semiconductor device with antenna and heat spreader | Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan, Sen-Kuei Hsu | 2019-11-26 |
| 10475757 | Package structure and manufacturing method thereof | Chao-Wen Shih, Shou-Zen Chang, Nan-Chin Chuang | 2019-11-12 |
| 10461166 | Electrical contact | Christian Albertus Nijhuis, Li Jiang, Suchand Sangeeth Chandramathi Sukumaran | 2019-10-29 |
| 10381309 | Package structure having connecting module | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Chun-Lin Lu, Chao-Wen Shih +2 more | 2019-08-13 |
| 10366966 | Method of manufacturing integrated fan-out package | Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu +5 more | 2019-07-30 |
| 10186492 | Package structure and manufacturing method thereof | Chao-Wen Shih, Shou-Zen Chang, Nan-Chin Chuang | 2019-01-22 |
| 10183858 | Semiconductor structure and method of manufacturing the same | Yu-Sheng Hsieh, Chao-Wen Shih, Shou-Zen Chang, Chung-Shi Liu, Chen-Hua Yu | 2019-01-22 |
| 10157807 | Sensor packages and manufacturing mehtods thereof | Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Yu-Sheng Hsieh | 2018-12-18 |
| 10157859 | Semiconductor device structure | Shou-Zen Chang, Chi-Ming Huang, Kai-Chiang Wu, Sen-Kuei Hsu, Hsin-Yu Pan +1 more | 2018-12-18 |
| 9875972 | Semiconductor device structure and method for forming the same | Shou-Zen Chang, Chi-Ming Huang, Kai-Chiang Wu, Sen-Kuei Hsu, Hsin-Yu Pan +1 more | 2018-01-23 |