Issued Patents All Time
Showing 1–25 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414304 | 3D monolithic stacking memory structure with oxide-semiconductor field effect transistor and ferroelectric metal-insulator-metal storage capacitor | Ming-Han Liao, Min-Cheng Chen, Hiroshi Yoshida | 2025-09-09 |
| 12394686 | Semiconductor structure and manufacturing method thereof | Chun-Lin Lu, Ming-Han Liao | 2025-08-19 |
| 12389613 | Semiconductor structure | Wei Wang, Michio Sakurai, Cheng-Yu Tsai | 2025-08-12 |
| 12354921 | Wafer structure including probe marked test pads | Chun-Lin Lu, Ying-Tsung Chu, Ming-Hsun Tsai | 2025-07-08 |
| 12354870 | Multilayer stacking wafer bonding structure and method of manufacturing the same | Chun-Lin Lu | 2025-07-08 |
| 12327777 | Semiconductor package structure and manufacturing method thereof | Chun-Lin Lu, Chi-Ming Chen | 2025-06-10 |
| 12266847 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Chao-Wen Shih, Albert Wan, Yu-Sheng Hsieh | 2025-04-01 |
| 12266619 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Kai-Chiang Wu, Chung-Shi Liu, Chao-Wen Shih | 2025-04-01 |
| 12101941 | Ferroelectric memory structure | Ming-Han Liao, Min-Cheng Chen, Hiroshi Yoshida | 2024-09-24 |
| 12046480 | Manufacturing method of a semiconductor device | Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen, Chuei-Tang Wang +3 more | 2024-07-23 |
| 12009575 | Package structure | Nan-Chin Chuang, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih | 2024-06-11 |
| 11967558 | Wafer stacking structure and manufacturing method thereof | Chun-Lin Lu, Jium Ming Lin | 2024-04-23 |
| 11917804 | Manufacturing method of SRAM device | Yi-Hsung Wei, Pei-Hsiu Tseng, Jia-You Lin | 2024-02-27 |
| 11855333 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Chao-Wen Shih, Albert Wan, Yu-Sheng Hsieh | 2023-12-26 |
| 11837564 | Semiconductor bonding structure | Chun-Lin Lu, Ying-Tsung Chu, Chi-Ming Chen | 2023-12-05 |
| 11800721 | Ferroelectric memory structure with different ferroelectric capacitors | Ming-Han Liao, Min-Cheng Chen, Hiroshi Yoshida | 2023-10-24 |
| 11749626 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Kai-Chiang Wu, Chung-Shi Liu, Chao-Wen Shih | 2023-09-05 |
| 11749648 | Circuit structure for testing through silicon vias in three-dimensional integrated circuit | Chun-Lin Lu, Chun-Cheng Chen | 2023-09-05 |
| 11721378 | Oxide semiconductor-based FRAM | Ming-Han Liao, Min-Cheng Chen, Hiroshi Yoshida | 2023-08-08 |
| 11705411 | Chip package with antenna element | Yung-Ping Chiang, Yi-Che Chiang, Nien-Fang Wu, Min-Chien Hsiao, Chao-Wen Shih +2 more | 2023-07-18 |
| 11658392 | Package structure | Nan-Chin Chuang, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih | 2023-05-23 |
| 11610621 | Oxide semiconductor-based FRAM | Ming-Han Liao, Min-Cheng Chen, Hiroshi Yoshida | 2023-03-21 |
| 11515618 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Chao-Wen Shih, Albert Wan, Yu-Sheng Hsieh | 2022-11-29 |
| 11502077 | Semiconductor devices having fin field effect transistor (FinFET) structures and manufacturing and design methods thereof | Tung Ying Lee, Wen-Huei Guo, Chih-Hao Chang | 2022-11-15 |
| 11488965 | SRAM device and manufacturing method thereof | Yi-Hsung Wei, Pei-Hsiu Tseng, Jia-You Lin | 2022-11-01 |