Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12355008 | Methods of fabricating package structure | Ming-Fa Chen, Chao-Wen Shih, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2025-07-08 |
| 12119328 | Methods of fabricating the same die stack structure and semiconductor structure | Ming-Fa Chen, Chao-Wen Shih, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-10-15 |
| 12015013 | Die stack structure, semiconductor structure and method of fabricating the same | Ming-Fa Chen, Chao-Wen Shih, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-06-18 |
| 11705411 | Chip package with antenna element | Yung-Ping Chiang, Yi-Che Chiang, Nien-Fang Wu, Chao-Wen Shih, Shou-Zen Chang +2 more | 2023-07-18 |
| 11264362 | Semiconductor structure and method of fabricating the same | Ming-Fa Chen, Chao-Wen Shih, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-03-01 |
| 11244896 | Package structure and manufacturing method thereof | Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu, Chieh-Yen Chen | 2022-02-08 |
| 11245176 | Package structure, electronic device and method of fabricating package structure | Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2022-02-08 |
| 11177355 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Tsung-Yuan Yu +1 more | 2021-11-16 |
| 11164848 | Semiconductor structure and method manufacturing the same | Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh, Tzuan-Horng Liu, Chuan-An Cheng | 2021-11-02 |
| 11004809 | Chip package with antenna element | Yung-Ping Chiang, Yi-Che Chiang, Nien-Fang Wu, Chao-Wen Shih, Shou-Zen Chang +2 more | 2021-05-11 |
| 10937719 | Package structure and method of fabricating the same | Yung-Ping Chiang, Chao-Wen Shih, Nien-Fang Wu, Shou-Zen Chang, Yi-Che Chiang | 2021-03-02 |
| 10535913 | Package structure, electronic device and method of fabricating package structure | Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2020-01-14 |
| 10312203 | Structure and formation method of chip package with antenna element | Yung-Ping Chiang, Nien-Fang Wu, Yi-Che Chiang, Chao-Wen Shih, Shou-Zen Chang +2 more | 2019-06-04 |
| 10276920 | Package structure, electronic device and method of fabricating package structure | Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2019-04-30 |
| 10269904 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Tsung-Yuan Yu +1 more | 2019-04-23 |
| 9530759 | 3D package with through substrate vias | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Chao-Wen Shih +1 more | 2016-12-27 |
| 9305877 | 3D package with through substrate vias | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Chao-Wen Shih +1 more | 2016-04-05 |
| 9202635 | Composite substrate for counter electrode of dye-sensitized solar cell | Chen-Chi Martin Ma, Chuan-Yu Yen, Shu-Hang Liao, Ming-Yu Yen | 2015-12-01 |