Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Chien-Hsun Chen, Tuan-Yu Hung, Hsin-Yu Pan, Wei-Kang Hsieh, Tsung-Hsien Chiang +8 more | 2025-09-02 |
| 12362275 | Method of fabricating package structure including a plurality of antenna patterns | Sen-Kuei Hsu, Hsin-Yu Pan | 2025-07-15 |
| 12021024 | Semiconductor device including a semiconductor die and a plurality of antenna patterns | Sen-Kuei Hsu, Hsin-Yu Pan | 2024-06-25 |
| 11705411 | Chip package with antenna element | Yung-Ping Chiang, Nien-Fang Wu, Min-Chien Hsiao, Chao-Wen Shih, Shou-Zen Chang +2 more | 2023-07-18 |
| 11532576 | Semiconductor package and manufacturing method thereof | Sen-Kuei Hsu, Hsin-Yu Pan | 2022-12-20 |
| 11444023 | Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor device | Sen-Kuei Hsu, Hsin-Yu Pan | 2022-09-13 |
| 11373922 | Semiconductor packages having thermal through vias (TTV) | Sen-Kuei Hsu, Ching-Feng Yang, Hsin-Yu Pan, Kai-Chiang Wu | 2022-06-28 |
| 11018113 | Memory module, semiconductor package including the same, and manufacturing method thereof | Lipu Kris Chuang, Chung-Hao Tsai, Hsin-Yu Pan, Chien-Chang Lin | 2021-05-25 |
| 11004809 | Chip package with antenna element | Yung-Ping Chiang, Nien-Fang Wu, Min-Chien Hsiao, Chao-Wen Shih, Shou-Zen Chang +2 more | 2021-05-11 |
| 10937719 | Package structure and method of fabricating the same | Yung-Ping Chiang, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Shou-Zen Chang | 2021-03-02 |
| 10818588 | Semiconductor device, package structure and method of fabricating the same | Sen-Kuei Hsu, Hsin-Yu Pan | 2020-10-27 |
| 10748831 | Semiconductor packages having thermal through vias (TTV) | Sen-Kuei Hsu, Ching-Feng Yang, Hsin-Yu Pan, Kai-Chiang Wu | 2020-08-18 |
| 10312203 | Structure and formation method of chip package with antenna element | Yung-Ping Chiang, Nien-Fang Wu, Min-Chien Hsiao, Chao-Wen Shih, Shou-Zen Chang +2 more | 2019-06-04 |