Issued Patents All Time
Showing 1–25 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418982 | Laminated structure with pads and manufacturing method thereof | Hao-Cheng Hou, Tsung-Ding Wang, Jung Wei Cheng, Chien-Hsun Lee | 2025-09-16 |
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Yi-Che Chiang, Tuan-Yu Hung, Hsin-Yu Pan, Wei-Kang Hsieh, Tsung-Hsien Chiang +8 more | 2025-09-02 |
| 12354924 | Integrated circuit package and method | Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2025-07-08 |
| 12280326 | System for separation of gas and solid | Kuen-Yi Wu | 2025-04-22 |
| 12249564 | Package structure, RDL structure comprising redistribution layer having ground plates and signal lines | Jiun Yi Wu, Shou-Yi Wang | 2025-03-11 |
| 12191251 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu | 2025-01-07 |
| 12183682 | Semiconductor package and manufacturing method thereof | Chien-Hsun Lee, Chung-Shi Liu, Jiun Yi Wu, Shou-Yi Wang, Tsung-Ding Wang | 2024-12-31 |
| 12080563 | Semiconductor devices and methods of manufacturing | Yu-Min Liang, Yen-Ping Wang, Jiun Yi Wu, Chen-Hua Yu, Kai-Chiang Wu | 2024-09-03 |
| 11984375 | Integrated circuit package and method | Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2024-05-14 |
| 11961814 | Integrated circuit package and method | Shou-Yi Wang, Jiun Yi Wu, Chung-Shi Liu, Chen-Hua Yu | 2024-04-16 |
| 11923315 | Semiconductor package and manufacturing method thereof | Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Wei-Ting Chen, Shih-Ya Huang | 2024-03-05 |
| 11903707 | Enclosed desorption electrospray ionization probes and method of use thereof | Robert Graham Cooks, Zheng Ouyang, Ziqing Lin, Livia Schiavinato Eberlin | 2024-02-20 |
| 11715686 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu | 2023-08-01 |
| 11670575 | Package structure, RDL structure comprising redistribution layer having ground plates and signal lines | Jiun Yi Wu, Shou-Yi Wang | 2023-06-06 |
| 11658085 | Integrated circuit package and method | Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2023-05-23 |
| 11530991 | Apparatus and method of determining biological property with test strip adaptor | Yenyu Chen, Yao-Ching Tsai | 2022-12-20 |
| 11532587 | Method for manufacturing semiconductor package with connection structures including via groups | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2022-12-20 |
| 11515173 | Semiconductor devices and methods of manufacturing | Yu-Min Liang, Yen-Ping Wang, Jiun Yi Wu, Chen-Hua Yu, Kai-Chiang Wu | 2022-11-29 |
| 11460498 | Adjustable probe device for impedance testing for circuit board | Yang-Hung Cheng, Ya-Hung Lo, Chia-Nan Chou, Chung-Yen Huang, Shou-Jen Tsai +1 more | 2022-10-04 |
| 11387576 | Antenna system | Cheng-Chieh Yang | 2022-07-12 |
| 11304637 | Enclosed desorption electrospray ionization probes and method of use thereof | Robert Graham Cooks, Zheng Ouyang, Ziqing Lin, Livia Schiavinato Eberlin | 2022-04-19 |
| 11239193 | Integrated circuit package and method | Shou-Yi Wang, Jiun Yi Wu, Chung-Shi Liu, Chen-Hua Yu | 2022-02-01 |
| 11217546 | Embedded voltage regulator structure and method forming same | Jiun Yi Wu, Chen-Hua Yu | 2022-01-04 |
| 11217497 | Integrated circuit package and method | Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2022-01-04 |
| 11195788 | Hybrid dielectric scheme in packages | Jiun Yi Wu, Chen-Hua Yu | 2021-12-07 |