Issued Patents All Time
Showing 26–50 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177218 | Package including metallic bolstering pattern and manufacturing method of the package | Jiun Yi Wu, Chien-Hsun Lee, Shou-Yi Wang | 2021-11-16 |
| 11171090 | Semiconductor device and method of manufacture | Jiun Yi Wu, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Shou-Yi Wang | 2021-11-09 |
| 11088059 | Package structure, RDL structure comprising redistribution layer having ground plates and signal lines and method of forming the same | Jiun Yi Wu, Shou-Yi Wang | 2021-08-10 |
| 11062998 | Semiconductor package and manufacturing method thereof | Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Wei-Ting Chen, Shih-Ya Huang | 2021-07-13 |
| 10971446 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu | 2021-04-06 |
| 10916519 | Method for manufacturing semiconductor package with connection structures including via groups | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2021-02-09 |
| 10838540 | Touch control device with ESD protection | Yung-Cheng Tsai, Chien-Le Li, Shih-Hong Jhang, You-Hong Jhang | 2020-11-17 |
| 10799165 | Enclosed desorption electrospray ionization probes and method of use thereof | Robert Graham Cooks, Zheng Ouyang, Ziqing Lin, Livia Schiavinato Eberlin | 2020-10-13 |
| 10685677 | Disc grabbing apparatus with different states for carrying and releasing disc | Ming-Chao Lee, Dong-Lin Jhong, Ming-Chun Tsao | 2020-06-16 |
| 10665520 | Integrated circuit package and method | Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2020-05-26 |
| 10555694 | Enclosed desorption electrospray ionization probes and method of use thereof | Robert Graham Cooks, Zheng Ouyang, Ziqing Lin, Livia Schiavinato Eberlin | 2020-02-11 |
| 10420495 | Enclosed desorption electrospray ionization probes and method of use thereof | Robert Graham Cooks, Zheng Ouyang, Ziqing Lin, Livia Schiavinato Eberlin | 2019-09-24 |
| 10213143 | Enclosed desorption electrospray ionization probes and method of use thereof | Robert Graham Cooks, Zheng Ouyang, Ziqing Lin, Livia Schiavinato Eberlin | 2019-02-26 |
| 10004440 | Enclosed desorption electrospray ionization probes and method of use thereof | Robert Graham Cooks, Zheng Ouyang, Ziqing Lin, Livia Schiavinato Eberlin | 2018-06-26 |
| 9847320 | Semiconductor structure and method of fabricating the same | William Wu Shen, Jiun Yi Wu, Chien-Hsun Lee | 2017-12-19 |
| 9841789 | Hinge assembly for electronic device | Yu-Kang Lin, Yen-Chung Chen, Chung-Chieh Huang | 2017-12-12 |
| 9823706 | Hinge component and the electronic device using thereof | Yen-Chung Chen, Yu-Kang Lin, Chung-Chieh Huang | 2017-11-21 |
| 9700251 | Enclosed desorption electrospray ionization probes and method of use thereof | Robert Graham Cooks, Zheng Ouyang, Ziqing Lin, Livia Schiavinato Eberlin | 2017-07-11 |
| 9653530 | Organic light-emitting diode module equipped with vertical electric connection structure | Po-Hsin Lin, Shih-Hung Chang, Shang-Chih Lin, Chia-Chi Huang, I-Hsuan Lin +3 more | 2017-05-16 |
| 9538945 | Desorption electrospray ionization sampling without damaging an in vivo tissue sample | Robert Graham Cooks, Zheng Ouyang, Ziqing Lin, Livia Schiavinato Eberlin | 2017-01-10 |
| 9276549 | Via system of printed circuit board and method of making same | Ming-Hsien Cheng, PO-CHUAN HSIEH, YING-TSO LAI | 2016-03-01 |
| 9276548 | Stacked LC resonator and band pass filter using the same | Tzyy-Sheng Horng, Chien-Hsiang Huang, Sung-Mao Wu | 2016-03-01 |
| 9024254 | Enclosed desorption electrospray ionization probes and method of use thereof | Robert Graham Cooks, Zheng Ouyang, Ziqing Lin, Livia Schiavinato | 2015-05-05 |
| 8895347 | Method for fabricating semiconductor layer having textured surface and method for fabricating solar cell | Teng-Yu Wang, Chen-Hsun Du, Chung-Yuan Kung | 2014-11-25 |
| 8872597 | Equalizer for loss-compensation of high-frequency signals generated in transmission channels | PO-CHUAN HSIEH | 2014-10-28 |