Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354924 | Integrated circuit package and method | Chien-Hsun Chen, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2025-07-08 |
| 12125757 | Semiconductor package with stiffener structure and method forming the same | Wensen Hung, Chien-Chia Chiu, Tsung-Yu Chen | 2024-10-22 |
| 11984375 | Integrated circuit package and method | Chien-Hsun Chen, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2024-05-14 |
| 11721602 | Semiconductor package with stiffener structure | Wensen Hung, Chien-Chia Chiu, Tsung-Yu Chen | 2023-08-08 |
| 11658085 | Integrated circuit package and method | Chien-Hsun Chen, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2023-05-23 |
| 11235009 | Method of ameliorating chronic kidney disease using Parabacteroides goldsteinii | Po-I Wu, Chih-Jung Chang | 2022-02-01 |
| 11217497 | Integrated circuit package and method | Chien-Hsun Chen, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2022-01-04 |
| 11147843 | Method of preventing or treating obesity using a novel strain of Parabacteroides goldsteinii | Po-I Wu, Chih-Jung Chang, Tzu-Lung Lin | 2021-10-19 |
| 11116803 | Method of treating lung cancer using Parabacteroides goldsteinii | Po-I Wu, Chih-Jung Chang | 2021-09-14 |
| 10665520 | Integrated circuit package and method | Chien-Hsun Chen, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2020-05-26 |
| 9620414 | Protecting flip-chip package using pre-applied fillet | Tsung-Fu Tsai, Yian-Liang Kuo, Ming-Song Sheu, Chen-Shien Chen, Han-Ping Pu | 2017-04-11 |
| 9064881 | Protecting flip-chip package using pre-applied fillet | Tsung-Fu Tsai, Yian-Liang Kuo, Ming-Song Sheu, Chen-Shien Chen, Han-Ping Pu | 2015-06-23 |
| 8927333 | Die carrier for package on package assembly | Tsung-Shu Lin, Han-Ping Pu | 2015-01-06 |
| 8373282 | Wafer level chip scale package with reduced stress on solder balls | Yu-Feng Chen, Han-Ping Pu, Hung-Jui Kuo, Yu Yi Huang | 2013-02-12 |