Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431366 | Structure having thermal dissipation structure therein and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2025-09-30 |
| 12159862 | Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices | Chia-Wei Tu, Yi Wang | 2024-12-03 |
| 11996368 | Pad structure for enhanced bondability | Ru-Ying Huang, Yung Ching Chen, Yueh-Chiou Lin | 2024-05-28 |
| 11959958 | Method of analyzing semiconductor structure | Yi-Min Liu, Chien-Yi Chen | 2024-04-16 |
| 11935760 | Package structure having thermal dissipation structure therein and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2024-03-19 |
| 11728279 | Pad structure for enhanced bondability | Ru-Ying Huang, Yung Ching Chen, Yueh-Chiou Lin | 2023-08-15 |
| 11227836 | Pad structure for enhanced bondability | Ru-Ying Huang, Yung Ching Chen, Yueh-Chiou Lin | 2022-01-18 |
| 10955459 | Method of analyzing semiconductor structure | Yi-Min Liu, Chien-Yi Chen | 2021-03-23 |
| 10867975 | Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices | Chia-Wei Tu, Yi Wang | 2020-12-15 |
| 10770366 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Tsung-Fu Tsai, Wen-Hsiung Lu | 2020-09-08 |
| 10510635 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Tsung-Fu Tsai, Wen-Hsiung Lu | 2019-12-17 |
| 10453818 | Packaging structures of integrated circuits | Tsung-Fu Tsai, Chia-Wei Tu, Ru-Ying Huang | 2019-10-22 |
| 10340258 | Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices | Chia-Wei Tu, Yi Wang | 2019-07-02 |
| 10269750 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2019-04-23 |
| 10056312 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Tsung-Fu Tsai, Wen-Hsiung Lu | 2018-08-21 |
| 9780009 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Tsung-Fu Tsai, Wen-Hsiung Lu | 2017-10-03 |
| 9659890 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2017-05-23 |
| 9620414 | Protecting flip-chip package using pre-applied fillet | Tsung-Fu Tsai, Ming-Song Sheu, Yu-Ling Tsai, Chen-Shien Chen, Han-Ping Pu | 2017-04-11 |
| 9196532 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Wen-Hsiung Lu, Hsien-Wei Chen, Tsung-Fu Tsai | 2015-11-24 |
| 9136235 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2015-09-15 |
| 9064881 | Protecting flip-chip package using pre-applied fillet | Tsung-Fu Tsai, Ming-Song Sheu, Yu-Ling Tsai, Chen-Shien Chen, Han-Ping Pu | 2015-06-23 |
| 9059158 | Semiconductor device having under-bump metallization (UBM) structure and method of forming the same | Tsung-Fu Tsai, Chih-Horng Chang | 2015-06-16 |
| 9053943 | Bond pad design for improved routing and reduced package stress | Yi-Mang CHOU | 2015-06-09 |
| 8994155 | Packaging devices, methods of manufacture thereof, and packaging methods | Tsung-Fu Tsai, Yu-Chang Lin, Ying-Ching Shih, Wei Wu, Chia-Wei Tu | 2015-03-31 |
| 8846548 | Post-passivation interconnect structure and methods for forming the same | Chia-Wei Tu, Wei-Lun Hsieh, Tsung-Fu Tsai | 2014-09-30 |