Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9053943 | Bond pad design for improved routing and reduced package stress | Yian-Liang Kuo | 2015-06-09 |
YC
Yi-Mang CHOU
Overall (All Time): #3,056,334 of 4,157,543Top 75%
1
Patents All Time