Issued Patents All Time
Showing 1–25 of 190 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431366 | Structure having thermal dissipation structure therein and manufacturing method thereof | Chen-Hua Yu, Yian-Liang Kuo | 2025-09-30 |
| 12374602 | Semiconductor structure having through substrate via and manufacturing method thereof | Wei-Ming Wang, Yu-Hung Lin, Yu-Hsiao Lin, Shih-Peng Tai | 2025-07-29 |
| 12362262 | Semiconductor device including through die via | Chen-Hua Yu | 2025-07-15 |
| 12347785 | Semiconductor structure and method manufacturing the same | Chen-Hua Yu | 2025-07-01 |
| 12341079 | Package structure and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung | 2025-06-24 |
| 12315831 | Package structure and manufacturing method thereof | Chen-Hua Yu | 2025-05-27 |
| 12315784 | Semiconductor package and manufacturing method thereof | Hung-Yi Kuo, Cheng-Chieh Hsieh, Chen-Hua Yu | 2025-05-27 |
| 12300646 | Chiplets 3D SoIC system integration and fabrication methods | Chen-Hua Yu | 2025-05-13 |
| 12293991 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Chih-Hang Tung | 2025-05-06 |
| 12283556 | Package structure | Chen-Hua Yu, Chun-Hui Yu | 2025-04-22 |
| 12272613 | Thermal structure for semiconductor device and method of forming the same | Wei-Ming Wang, Yu-Hung Lin, Shih-Peng Tai | 2025-04-08 |
| 12261142 | Semiconductor structure including thermal enhanced bonding structure | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Po-Fan Lin | 2025-03-25 |
| 12238865 | Integrated circuit structure | Chen-Hua Yu, Jui-Pin Hung | 2025-02-25 |
| 12224276 | 3D semiconductor packages | Chen-Hua Yu, Chun-Hui Yu, Liang-Ju Yen | 2025-02-11 |
| 12218089 | Packaged semiconductor device and method of forming thereof | Chen-Hua Yu, Chih-Hang Tung | 2025-02-04 |
| 12209015 | MEMS packages and methods of manufacture thereof | Chen-Hua Yu | 2025-01-28 |
| 12199065 | Multi-die package structures including redistribution layers | Chen-Hua Yu, Tsung-Ding Wang, Chien-Hsun Lee | 2025-01-14 |
| 12191279 | Integrated circuit packages and methods of forming the same | Chen-Hua Yu | 2025-01-07 |
| 12142597 | Integrated fan-out package and the methods of manufacturing | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2024-11-12 |
| 12080615 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2024-09-03 |
| 12057406 | Package having redistribution layer structure with protective layer | Chen-Hua Yu, Chun-Hui Yu | 2024-08-06 |
| 12040566 | Antenna device | Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Chen-Hua Yu | 2024-07-16 |
| 12033976 | Semiconductor package having a through intervia through the molding compound and fan-out redistribution layers disposed over the respective die of the stacked fan-out system-in-package | Chen-Hua Yu | 2024-07-09 |
| 12014993 | Package having redistribution layer structure with protective layer and method of fabricating the same | Chen-Hua Yu, Chun-Hui Yu | 2024-06-18 |
| 11978691 | Semiconductor device and manufacturing method thereof | Chen-Hua Yu | 2024-05-07 |